公开(公告)号：WO2006053213A1

公开(公告)日：2006-05-18

申请号：PCT/US2005/040917

申请日：2005-11-09

Applicant: UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC. ,  NISHIDA, Toshikazu ,  THOMPSON, Scott, E. ,  OGDEN, Al ,  WU, Kehuey

Inventor： NISHIDA, Toshikazu ,  THOMPSON, Scott, E. ,  OGDEN, Al ,  WU, Kehuey

IPC: H01L21/322 ,  H01L29/84 ,  H01L23/051

CPC classification number: H01L23/13 ,  H01L23/04 ,  H01L23/562 ,  H01L29/7842 ,  H01L29/84 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/00

Abstract: A packaged semiconductor device (450) includes a semiconductor chip (400) having at least one selectively thinned substrate (cavity) region (410). A package (460) is provided for mounting, enclosing and electrically connecting the chip (400) to the outside world, and structure for applying external stress (470) to induce strain in the thinned substrate region (410). The external stress is preferably adjustable, such as by varying the gas flow (or a vacuum) applied through a pressure valve.

Abstract translation: 封装的半导体器件（450）包括具有至少一个选择性薄化的衬底（空腔）区域（410）的半导体芯片（400）。 提供了用于将芯片（400）安装，封装和电连接到外界的封装（460），以及用于施加外部应力（470）以在减薄的衬底区域（410）中引起应变的结构。 外部应力优选是可调节的，例如通过改变通过压力阀施加的气流（或真空）。