公开(公告)号：WO2013119737A3

公开(公告)日：2014-02-27

申请号：PCT/US2013025035

申请日：2013-02-07

Applicant: CORNING INC ,  ABRAMOV ANATOLI ANATOLYEVICH ,  BELLMAN ROBERT ALAN ,  BOOKBINDER DANA CRAIG ,  CHUANG TA-KO ,  DOMEY JEFFREY JOHN ,  ENICKS DARWIN GENE ,  GASKILL LINDA ,  KANG KIAT CHYAI ,  KEMMERER MARVIN WILLIAM ,  KUO KUAN-TING ,  LIN JEN-CHIEH ,  MANLEY ROBERT GEORGE ,  THOMAS JOHN CHRISTOPHER ,  TSENG PEI-LIEN ,  ZHANG JIAN-ZHI JAY

Inventor： ABRAMOV ANATOLI ANATOLYEVICH ,  BELLMAN ROBERT ALAN ,  BOOKBINDER DANA CRAIG ,  CHUANG TA-KO ,  DOMEY JEFFREY JOHN ,  ENICKS DARWIN GENE ,  GASKILL LINDA ,  KANG KIAT CHYAI ,  KEMMERER MARVIN WILLIAM ,  KUO KUAN-TING ,  LIN JEN-CHIEH ,  MANLEY ROBERT GEORGE ,  THOMAS JOHN CHRISTOPHER ,  TSENG PEI-LIEN ,  ZHANG JIAN-ZHI JAY

IPC: H01L21/50

CPC classification number: C03C27/10 ,  B23K26/40 ,  B23K2203/50 ,  B32B7/06 ,  B32B17/06 ,  B65G2249/02 ,  C03B33/07 ,  C03B33/091

Abstract: A method of removing a desired part of a thin sheet (20) from a thin sheet bonded to a carrier (10) by a bonded area (40) that surrounds a non-bonded area (50), wherein the method includes forming a perimeter vent (60) defining a perimeter of the desired part (56), wherein the perimeter vent is disposed within the non-bonded area and has a depth >= 50% of the thickness (22) of the thin sheet. Prior to removing the desired part, a device may be processed onto the thin sheet. In some processes, the carrier is diced so it may be processed in smaller sizes, yet maintains a hermetically sealed edge. After dicing, an additional part of the device may be processed onto the thin sheet, and the desired part is removed by removing a desired part of the thin sheet from the carrier.

Abstract translation: 一种从通过围绕非接合区域（50）的接合区域（40）从结合到载体（10）的薄片去除薄片（20）的期望部分的方法，其中所述方法包括形成周边 限定所需部分（56）的周边的排气口（60），其中所述周边通气口设置在所述非接合区域内，并且具有所述薄片厚度（22）的深度> = 50％。 在去除期望的部件之前，可以在薄片上处理装置。 在一些工艺中，载体被切割，因此可以以较小的尺寸加工，同时保持密封的边缘。 在切割之后，可以将另一部分装置加工到薄片上，并通过从载体上移除所需薄片的一部分来除去所需的部分。

公开(公告)号：WO2013119737A2

公开(公告)日：2013-08-15

申请号：PCT/US2013/025035

申请日：2013-02-07

Applicant: CORNING INCORPORATED ,  ABRAMOV, Anatoli Anatolyevich ,  BELLMAN, Robert Alan ,  BOOKBINDER, Dana Craig ,  CHUANG, Ta-Ko ,  DOMEY, Jeffrey John ,  ENICKS, Darwin Gene ,  GASKILL, Linda ,  KANG, Kiat Chyai ,  KEMMERER, Marvin William ,  KUO, Kuan-Ting ,  LIN, Jen-Chieh ,  MANLEY, Robert George ,  THOMAS, John Christopher ,  TSENG, Pei-Lien ,  ZHANG, Jian-Zhi Jay

Inventor： ABRAMOV, Anatoli Anatolyevich ,  BELLMAN, Robert Alan ,  BOOKBINDER, Dana Craig ,  CHUANG, Ta-Ko ,  DOMEY, Jeffrey John ,  ENICKS, Darwin Gene ,  GASKILL, Linda ,  KANG, Kiat Chyai ,  KEMMERER, Marvin William ,  KUO, Kuan-Ting ,  LIN, Jen-Chieh ,  MANLEY, Robert George ,  THOMAS, John Christopher ,  TSENG, Pei-Lien ,  ZHANG, Jian-Zhi Jay

IPC: H01L21/50

CPC classification number: C03C27/10 ,  B23K26/40 ,  B23K2203/50 ,  B32B7/06 ,  B32B17/06 ,  B65G2249/02 ,  C03B33/07 ,  C03B33/091

Abstract: A method of removing a desired part of a thin sheet (20) from a thin sheet bonded to a carrier (10) by a bonded area (40) that surrounds a non-bonded area (50), wherein the method includes forming a perimeter vent (60) defining a perimeter of the desired part (56), wherein the perimeter vent is disposed within the non-bonded area and has a depth.. 50% of the thickness (22) of the thin sheet. Prior to removing the desired part, a device may be processed onto the thin sheet. In some processes, the carrier is diced so it may be processed in smaller sizes, yet maintains a hermetically sealed edge. After dicing, an additional part of the device may be processed onto the thin sheet, and the desired part is removed by removing a desired part of the thin sheet from the carrier.

Abstract translation: 一种从通过围绕非接合区域（50）的接合区域（40）从结合到载体（10）的薄片去除薄片（20）的期望部分的方法，其中所述方法包括形成周边 限定所需部分（56）的周边的排气口（60），其中所述周边通气口设置在所述非接合区域内并具有所述薄片厚度（22）的深度。 在移除所需部件之前，可以将设备加工到薄片上。 在一些工艺中，载体被切割，因此可以以较小的尺寸加工，同时保持密封的边缘。 在切割之后，可以将另一部分装置加工到薄片上，并且通过从载体上移除所需薄片的所需部分来除去所需的部分。