公开(公告)号：WO2011137756A3

公开(公告)日：2012-04-05

申请号：PCT/CN2011073751

申请日：2011-05-06

申请人： HUAWEI DEVICE CO LTD ,  YANG JUN ,  ZHOU LIECHUN ,  LI HUALIN ,  WU XIJIE

发明人： YANG JUN ,  ZHOU LIECHUN ,  LI HUALIN ,  WU XIJIE

IPC分类号： H05K7/20 ,  H01L23/373 ,  H01L23/552 ,  H05K9/00

CPC分类号： H05K1/0204 ,  H01L23/552 ,  H01L24/18 ,  H05K1/0216 ,  H05K7/20472 ,  H05K9/003 ,  H05K2201/0715 ,  H05K2201/2018 ,  Y02D70/12 ,  Y02D70/122 ,  Y10T428/264 ,  Y10T428/30 ,  Y10T428/31504 ,  Y10T428/31678

摘要： A composite material and an electron device are provided. The composite material comprises a heat conducting and electric conducting layer (41), a viscose glue layer (42) and an insulating layer (43), and the heat conducting and electric conducting layer (41) and the insulating layer (43) are pasted at the two sides of the viscose glue layer (42). The viscose glue layer (42) is electrically conductive. The electron device comprises electronic components (2) and shielding frames (3). Gaps are formed on insulating layer (43) at the positions relevant to the electronic components (2) and/or shielding frames (3) where the viscose glue layer is emerged, and the composite material is pasted on the electronic components and/or shielding frames by the viscose glue layer (42). The composite material can radiate and shield electromagnetism simultaneously and simplify the structure of the electron device.

摘要翻译： 提供复合材料和电子器件。 复合材料包括导热导电层（41），粘胶层（42）和绝缘层（43），导热导电层（41）和绝缘层（43）被粘贴 在粘胶层（42）的两侧。 粘胶层（42）是导电的。 电子器件包括电子部件（2）和屏蔽框架（3）。 在绝缘层（43）上形成有与出现粘胶层的电子部件（2）和/或屏蔽框架（3）相关的位置上的间隙，并将复合材料粘贴在电子部件和/或屏蔽 由粘胶层（42）构成。 复合材料可以同时辐射和屏蔽电磁，并简化电子器件的结构。

公开(公告)号：WO2011150874A3

公开(公告)日：2012-05-10

申请号：PCT/CN2011075708

申请日：2011-06-14

申请人： HUAWEI DEVICE CO LTD ,  ZOU JIE ,  ZHOU LIECHUN ,  WU XIJIE ,  YANG JUN

发明人： ZOU JIE ,  ZHOU LIECHUN ,  WU XIJIE ,  YANG JUN

IPC分类号： H05K7/20

CPC分类号： H05K7/20 ,  H01M10/658 ,  H05K5/0213

摘要： A device with a heat insulation structure is provided by embodiments of the present invention. The device includes an object to be heat-insulated (10), and a heat insulation closed layer (20) which is disposed between the object to be heat-insulated (10) and a heat source (30). The heat insulation structure adopted in the present invention is specifically a heat insulation closed layer (20), which achieves heat insulation protection with a closed space disposed between the object to be heat-insulated (10) and the heat source (30), rather than mainly insulates heat with a physical material with low thermal conductivity. By insulating the heat through the closed space, direct contact conduction of heat is reduced, and heat transmission in the form of heat convection and heat radiation can be reduced with the closed space effectively, thereby solving the problem of heat transferring from the heat source to the object to be heat-insulated, improving the heat insulation effect, and reducing the temperature of the work environment of the object to be heat-insulated.

摘要翻译： 具有隔热结构的装置由本发明的实施例提供。 该装置包括要被隔热的物体（10）和设置在待绝热物体（10）和热源（30）之间的绝热封闭层（20）。 本发明中采用的隔热结构具体是隔热封闭层（20），其通过设置在被隔热物（10）和热源（30）之间的封闭空间来实现隔热保护，而不是 主要是与具有低导热性的物理材料绝热。 通过将热量隔绝在封闭空间内，热量的直接接触传导降低，并且可以有效地减少热对流和热辐射形式的热传递，从而解决了热源传热问题 要隔热的物体，提高隔热效果，并降低被隔热物体的工作环境温度。