公开(公告)号：WO2004103039A1

公开(公告)日：2004-11-25

申请号：PCT/JP2004/006649

申请日：2004-05-18

Applicant: 大日本印刷株式会社 ,  小田 和範

Inventor： 小田 和範

IPC: H05K1/11

CPC classification number: H01L21/486 ,  H01L23/142 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/26 ,  H05K3/28 ,  H05K3/4069 ,  H05K3/426 ,  H05K3/427 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2203/025 ,  H05K2203/0353 ,  Y10T29/49165 ,  H01L2224/0401

Abstract: Wiring layers (191, 192) are formed on both roughened base surfaces (110S) of a core base (110) by a semi-additive method, only one layer on each surface. The wirings of the wiring layers are electrically connected through a though hole (180) made in the core base. The through hole is made in the core base by using a laser and filled with an electrical connection portion (193) formed by plating. The both sides of the core base are coated with a solder resist (160), with a predetermined terminal portion (170) exposed. The outer surfaces of the through hole and the outer surfaces of the wiring layers are planalized by mechanical polishing, chemical-mechanical polishing, or the like.

Abstract translation: 通过半添加法在芯基（110）的两个粗糙化的基面（110S）上形成布线层（191,192），每个表面上只有一层。 布线层的布线通过在芯基部中形成的通孔（180）电连接。 通孔使用激光器形成在芯基体中，并且填充有通过电镀形成的电连接部分（193）。 核心基座的两侧涂覆有防焊剂（160），暴露预定的端子部分（170）。 通孔的外表面和布线层的外表面通过机械抛光，化学机械抛光等进行平面化。