Abstract:
A pattern of material is continuously deposited onto a substrate. The substrate and a mask are continuously brought together over a portion of a drum where a deposition source emits material. The mask includes apertures that form a pattern, and the material from the deposition source passes through the pattern of the mask and collects onto the substrate to form the pattern of material. The elongation and the transverse position of the substrate and the mask may be controlled. Pattern elements of the substrate and of the mask may be sensed in order to adjust the elongation and/or the transverse position of the substrate and/or mask to maintain a precise registration. Furthermore, the apertures may have a least dimension on the order of 100 microns or less to thereby create features on the substrate having least dimensions on the order of 100 microns or less.
Abstract:
A web-handling machine frame, at least partially built from reconfigurable interconnected blocks having precision alignment points. From such blocks, modular equipment web-handling lines for web-handling operations can be constructed ad hoc with their shaft mounted web-contacting devices in tram without the need for separate alignment procedures.
Abstract:
Injection molding, parts onto a carrier web (34) located between mold halves (18,20). Flow of polymer melt into the mold is assisted by application of ultrasonic energy to the mold cavity. After the molding operation, mold halves are separated, and the carrier web is advanced, or indexed, to a next position for another molding sequence. Molding apparatus comprises a moving mold face (20), that can move toward and away from a first mold member (18) (which can be stationary) in which the mold cavity is located, a means (24,25,26,30,32) for moving and/or indexing carrier web between the first mold member and the moving mold face, means (16) to inject polymer melt into the mold cavity, and an ultrasonic system (42) providing ultrasonic energy to the mold cavity. The carrier web can transport molded parts to subsequent process steps, such as coating, drying, inspection, curing, assembly or packaging.
Abstract:
A keypad having a virtual floating image that appears to a user to be in a plane other than the apparent plane of the keypad surface. More particularly, the indicia on the keypad appear to float above or below the surface of the device. The keypad can be, for example, the keypad on a cell phone. For such an application there would be more than one array of indicia present on the keypad. For example, there might be ten arrays of indicia, which provide the numerals from 0 to 9 and two more arrays to provide virtual images of the * and # keys. In some embodiments, the keypad is integrated with an illumination source that light up the indicia. The present disclosure also provides a method of manufacturing a key pad with a virtual floating image.
Abstract:
A manufacturing system includes a sensing system that provides high-resolution feedback for web guiding and tension control. The system may be especially useful for web material that is manufactured to include micro-replicated structures with micron size scale. A micro-replication station forms a pattern of micro-replicated lenses on a web material. The sensing system illuminates a measurement area on the web material and detects an angular distribution of light exiting a set of the micro-replicated lenses within the first measurement area. A control system that adjusts at least one process control parameter of the transport system based on the detected angular distribution.
Abstract:
A liquid crystal cell article includes a layer of liquid crystal material disposed between a first polymeric substrate and a second polymeric substrate. The first polymeric substrate includes a plurality of first parallel conductive traces extending in a first direction and disposed between the layer of liquid crystal material and the first substrate, and a first release liner disposed on the first polymeric substrate. The second polymeric substrate includes a plurality of second parallel conductive traces extending in a second direction orthogonal to the first direction and disposed between the layer of liquid crystal material and the second substrate. The first polymeric substrate further includes a removable portion that is separable from the first polymeric substrate with the first release liner to expose a portion of the layer of liquid crystal material or second parallel conductive traces.
Abstract:
A method of controlling a moving web (12) in relation to a selected transverse position comprising positioning a first positioning guide (14) proximate a second positioning guide (16) wherein the second positioning guide has a mechanism for positioning the web having minimal backlash. The web is passed through the first positioning guide and the second positioning guide. A sensor (54) detects the transverse position of the moving web at the second positioning guide. The sensor transmits the transverse location of the web at the second positioning guide to a controller (56). The controller manipulates a zero-backlash actuator (58) wherein the zero-backlash actuator is coupled to the second positioning guide such that the transverse position of the web is controllable to within a preselected dimension of the selected transverse position.
Abstract:
Folded radio frequency identification tag devices and methods for high-volume, low-cost production are disclosed. The folded construction of the devices and methods of the present invention can reduce the complexity of the RFID tags by providing a one-sided circuit design. The resonant frequency of the circuits formed on the devices may be tuned by severing selected connections to one or more tuning capacitor plates 50, 52 that form a part of the capacitor structure. Severing connections to the tuning capacitor plates changes the capacitance of the circuit which, in turn, changes the resonant frequency of the circuit. After folding the outer end of the planer antenna coil 20 is connected via connection pads 60, 62 to an inner portion of the coil, where 3C chip can be mounted.