LED MOUNTING STRUCTURES
    4.
    发明申请
    LED MOUNTING STRUCTURES 审中-公开
    LED安装结构

    公开(公告)号:WO2007133857A2

    公开(公告)日:2007-11-22

    申请号:PCT/US2007/065425

    申请日:2007-03-29

    Abstract: An LED assembly may include a substrate, an elongate mounting structure that is formed in or on the substrate, and an LED that is mechanically secured to the elongate mounting structure. A light producing apparatus may include a substrate, an elongate mounting structure that may be formed in or on the substrate, and a plurality of LEDs that may be removably secured to the elongate mounting structure. A light producing array may include a substrate, a first elongate mounting structure that is formed in or on the substrate, and a second elongate mounting structure that is formed in or on the substrate. A first plurality of LEDs may be removably secured to the first elongate mounting structure. A second plurality of LEDs may be removably secured to the second elongate mounting structure.

    Abstract translation: LED组件可以包括衬底,形成在衬底中或衬底上的细长安装结构,以及机械地固定到细长安装结构的LED。 发光装置可以包括基板,可以形成在基板中或基板上的细长安装结构,以及可拆卸地固定到细长安装结构的多个LED。 发光阵列可以包括衬底,形成在衬底中或衬底上的第一细长安装结构,以及形成在衬底中或衬底上的第二细长安装结构。 第一多个LED可以可拆卸地固定到第一细长安装结构。 第二多个LED可以可拆卸地固定到第二细长安装结构。

    ILLUMINATION DEVICES AND METHODS FOR MAKING THE SAME
    6.
    发明申请
    ILLUMINATION DEVICES AND METHODS FOR MAKING THE SAME 审中-公开
    照明装置及其制造方法

    公开(公告)号:WO2006098799A2

    公开(公告)日:2006-09-21

    申请号:PCT/US2006/000781

    申请日:2006-03-10

    CPC classification number: F21K9/00

    Abstract: The present disclosure is generally directed to illumination devices, and particularly directed to illumination devices utilizing light transmissive layers and methods for making the same. An illumination device and method for making the device are disclosed. The device, in particular, includes a substrate and conductive region disposed on the substrate. One or more light sources, such as LEDs, are disposed on a surface of the substrate and electrically coupled to the electrically conductive region for supply of electric current. The device also includes one or more light transmissive layers disposed on the substrate and the at least one light source to encapsulate light sources and also to control characteristics of light delivery from the light sources as light passes through the light transmissive layers.

    Abstract translation: 本公开一般涉及照明装置,并且特别涉及利用透光层的照明装置及其制造方法。 公开了一种用于制造该装置的照明装置和方法。 该装置特别地包括设置在基板上的基板和导电区域。 一个或多个光源(例如LED)被布置在基板的表面上并且电耦合到导电区域以供应电流。 该装置还包括一个或多个设置在基板上的透光层和至少一个光源以封装光源,并且还用于当光通过透光层时控制来自光源的光输送的特性。

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