中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

26 records (took 0.017 seconds)

    SHIMMING ADHESIVE
    1.
    发明申请
    SHIMMING ADHESIVE 审中-公开

    公开(公告)号：WO2021124049A1

    公开(公告)日：2021-06-24

    申请号：PCT/IB2020/061832

    申请日：2020-12-11

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： ELGIMIABI, Sohaib ,  SPIEKERMANN, Stefan ,  CHEN, Lianzhou

    IPC: C08G59/38 ,  C08G59/42 ,  C08G59/50 ,  C08K3/013 ,  C08K3/36 ,  C08K5/521 ,  C09J163/00 ,  C08G59/4253 ,  C08G59/504

    Abstract: Provided are two-part shimming adhesives comprising a base part and a hardener part that are curable upon mixing. The base part includes a multifunctional epoxy resin having an epoxide functionality of at least three, a difunctional epoxy resin miscibly blended with the multifunctional epoxy resin. The hardener part includes a polyetheramine. Either the base part or hardener part further comprises an inorganic filler present in an amount from 10 percent to 60 percent, relative to the overall weight of the two-part curable shimming adhesive, and a phosphoric acid ester. The shimming adhesive enables joints to be assembled in one step, providing a significant advantage to the user.

    STRUCTURAL ADHESIVE WITH IMPROVED FAILURE MODE
    2.
    发明申请
    STRUCTURAL ADHESIVE WITH IMPROVED FAILURE MODE 审中-公开
    具有改进的失效模式的结构粘合剂

    公开(公告)号：WO2017087651A1

    公开(公告)日：2017-05-26

    申请号：PCT/US2016/062498

    申请日：2016-11-17

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： CURA, Elisabeth ,  ELGIMIABI, Sohaib

    IPC: C09J163/00

    CPC classification number: C09J163/00 ,  C08G2650/56 ,  C08K3/04 ,  C08K7/00 ,  C08L71/00

    Abstract: The present disclosure provides a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; non-spherical particles. This composition can be useful for applications, for example, in the form of an adhesive film. Such applications can include bonding of parts (e.g., metal parts), especially those where bonding on an industrial scale is required. The structural adhesive composition may exhibit any one or more of advantageous adhesive strength, a certain resistance to corrosion, as well as a favourable cohesive failure mode.

    Abstract translation: 本公开提供了包含环氧化合物的热固性结构粘合剂组合物; 热塑性化合物; 环氧固化剂; 非球形颗粒。 该组合物可用于例如粘合剂膜形式的应用。 这种应用可以包括部件（例如金属部件）的粘合，特别是需要工业规模粘合的部件。 结构粘合剂组合物可以表现出有利的粘合强度，一定的耐腐蚀性以及良好的内聚破坏模式中的任何一种或多种。

    HIGH PERFORMANCE EPOXY ADHESIVE COMPOSITIONS
    4.
    发明申请
    HIGH PERFORMANCE EPOXY ADHESIVE COMPOSITIONS 审中-公开
    高性能环氧胶粘剂组合物

    公开(公告)号：WO2018022555A1

    公开(公告)日：2018-02-01

    申请号：PCT/US2017/043622

    申请日：2017-07-25

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： ELGIMIABI, Sohaib

    IPC: C08G59/50 ,  C08G59/56 ,  C08G59/68

    Abstract: The present disclosure is directed to a precursor composition for a curable adhesive, the precursor comprising: a) a part (A) comprising: i. a first epoxy curing agent comprising at least one polyether amine and having an amine equivalent weight of at least 45 grams per mole of amine equivalents; ii. a second epoxy curing agent distinct from the first epoxy curing agent or a secondary curative; iii. a metal nitrate catalyst; iv. optionally, a metal triflate catalyst; and b) a part (B) comprising: i. a multifunctional first epoxy resin having at least three functional groups; ii. a second epoxy resin distinct from the first epoxy resin; iii. a core-shell polymer toughening agent iv. a filler material; and v. optionally, an epoxy-based reactive diluent. The compositions of the present disclosure are particularly suitable for use in structural bonding applications, in particular for adhesively bonding parts in manufacturing operations in aeronautic and aerospace industries. The present disclosure also relates to method of using such epoxy resin based curable compositions.

    Abstract translation: 本公开涉及用于可固化粘合剂的前体组合物，所述前体包含：a）部分（A），其包含：i。 第一环氧固化剂，其包含至少一种聚醚胺并且胺当量重量为每摩尔胺当量至少45克; II。 不同于第一环氧固化剂或第二固化剂的第二环氧固化剂; III。 金属硝酸盐催化剂; IV。 任选地，金属三氟甲磺酸盐催化剂; 和b）部分（B），包括：i。 具有至少三个官能团的多官能第一环氧树脂; II。 与第一环氧树脂不同的第二环氧树脂; III。 核壳聚合物增韧剂iv。 填充材料; 和v。任选地，基于环氧的反应性稀释剂。 本公开的组合物特别适用于结构粘合应用，特别是用于在航空和航空航天工业中的制造操作中粘合部件。 本公开还涉及使用这种基于环氧树脂的可固化组合物的方法。

    TWO-PART EPOXY RESIN COMPOSITIONS WITH LATENT CURING AGENT
    5.
    发明申请
    TWO-PART EPOXY RESIN COMPOSITIONS WITH LATENT CURING AGENT 审中-公开
    具有固化剂的两部分环氧树脂组合物

    公开(公告)号：WO2015084627A1

    公开(公告)日：2015-06-11

    申请号：PCT/US2014/067224

    申请日：2014-11-25

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： CARUSO DAILEY, Mary M. ,  ELGIMIABI, Sohaib

    IPC: C08G59/40 ,  C08G59/56 ,  C09J163/00

    CPC classification number: C08G59/56 ,  C08G59/4021 ,  C09J163/00

    Abstract: In one embodiment, a method of bonding a substrate is described. The method comprises providing an epoxy resin composition comprising a first liquid part comprising an epoxy resin; and a second liquid part comprising a combination of curing agents. The second liquid part comprises a first (e.g. ambient temperature) curing agent having an activation temperature at or below 20-25°C and a second latent curing agent having an activation temperature greater than 25°C. The method further comprises applying a mixture of the first and second part such that it contacts at least one substrate and curing the mixture below the activation temperature of the latent curing agent. The method does not include heating the mixture to the activation temperature of the latent curing agent. Rather, the latent curing agent can become activated during use of a substrate or article. In another embodiment, an article is described comprising at least one first substrate bonded with a cured epoxy resin composition wherein the cured epoxy resin composition comprises an uncured latent curing agent having an activation temperature greater than 25°C. Also described is a two-part epoxy resin composition comprising a first liquid part comprising an epoxy resin; and a second liquid part comprising a first curing agent having an activation temperature at or below 20-25°C and a second latent curing agent having an activation temperature greater than 25°C.

    Abstract translation: 在一个实施例中，描述了接合衬底的方法。 该方法包括提供环氧树脂组合物，其包含包含环氧树脂的第一液体部分; 和包含固化剂组合的第二液体部分。 第二液体部分包含具有或低于20-25℃的活化温度的第一（例如环境温度）固化剂和活化温度大于25℃的第二潜在性固化剂。 该方法还包括施加第一和第二部分的混合物，使得其接触至少一个基底并将该混合物固化低于潜伏性固化剂的活化温度。 该方法不包括将混合物加热至潜在性固化剂的活化温度。 相反，潜在性固化剂可以在使用基材或制品期间变得活化。 在另一个实施方案中，描述了包含至少一个与固化环氧树脂组合物接合的第一基材的制品，其中固化的环氧树脂组合物包含活化温度大于25℃的未固化的潜在性固化剂。 还描述了两部分环氧树脂组合物，其包含包含环氧树脂的第一液体部分; 以及第二液体部分，其包含具有或低于20-25℃的活化温度的第一固化剂和活化温度大于25℃的第二潜在性固化剂。

    METAL PANEL ASSEMBLY AND METHOD FOR MAKING SAME
    6.
    发明申请
    METAL PANEL ASSEMBLY AND METHOD FOR MAKING SAME 审中-公开
    金属面板组件及其制造方法

    公开(公告)号：WO2012166257A1

    公开(公告)日：2012-12-06

    申请号：PCT/US2012/033857

    申请日：2012-04-17

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  ELGIMIABI, Sohaib

    Inventor： ELGIMIABI, Sohaib

    IPC: B21D39/02 ,  B62D27/02 ,  C09J5/06 ,  C09J163/00 ,  F16B11/00 ,  C09J5/00

    CPC classification number: B21D39/021 ,  B21D39/028 ,  B60J5/0469 ,  B62D27/02 ,  B62D27/026 ,  C09J5/06 ,  C09J163/00 ,  C09J2400/163 ,  C09J2463/00 ,  F16B11/006 ,  Y10T29/49906 ,  Y10T428/192

    Abstract: In accordance with the present invention there is provided a method of making a metal part assembly, the method comprising: - providing a first metal part and a second metal part wherein at least one of the first and second metal part comprises a metal panel; - providing an adhesive sheet having a first portion near a first end of the adhesive sheet and a second portion near a second end opposite to the first end of the adhesive sheet, the adhesive sheet comprising a thermosettable composition that comprises a mixture of a first and second epoxy compound and an epoxy curing agent, wherein the first epoxy compound has a weight average molecular weight of at least 1000 g/mol and has an amount of epoxy groups of between 5 and 10 mole% and the second epoxy compound has a weight average molecular weight of not more than 400 g/mol and wherein the weight ratio of first to second epoxy compound is between 0.8 and 4; - adhering said first and second metal part together such that the adhesive sheet is provided between said first and second metal part thereby forming a metal joint; and heating the metal joint so as to cause thermosetting of the thermosettable composition of the adhesive sheet.

    Abstract translation: 根据本发明，提供了一种制造金属部件组件的方法，该方法包括： - 提供第一金属部件和第二金属部件，其中第一和第二金属部件中的至少一个包括金属板; - 提供具有靠近所述粘合片的第一端附近的第一部分的粘合片和在与所述粘合片的第一端相对的第二端附近的第二部分，所述粘合片包括可热固化的组合物，其包含第一和 第二环氧化合物和环氧固化剂，其中所述第一环氧化合物的重均分子量为至少1000g / mol，并且环氧基团的量为5至10mol％，并且所述第二环氧化合物具有重均分子量 分子量不超过400g / mol，其中第一和第二环氧化合物的重量比在0.8和4之间; - 将所述第一和第二金属部分粘合在一起，使得所述粘合片设置在所述第一和第二金属部分之间，从而形成金属接头; 并加热金属接头以使粘合片的可热固组合物的热固化。

    FIRE-RETARDANT LOW-DENSITY EPOXY COMPOSITION
    7.
    发明申请
    FIRE-RETARDANT LOW-DENSITY EPOXY COMPOSITION 审中-公开
    阻燃低密度环氧组合物

    公开(公告)号：WO2006071820A1

    公开(公告)日：2006-07-06

    申请号：PCT/US2005/046940

    申请日：2005-12-23

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  ELGIMIABI, Sohaib ,  LAMON, Alain

    Inventor： ELGIMIABI, Sohaib ,  LAMON, Alain

    IPC: C08K13/02 ,  C08G59/00 ,  C08L63/00

    CPC classification number: C09K21/04 ,  C08K3/22 ,  C08K3/32 ,  C09K21/02 ,  C08L63/00

    Abstract: The present invention relates to a curable precursor of a fire-retardant, low-density and essentially halogen-free epoxy composition comprising (i) 10 to 70 weight percent of at least one organic epoxide compound with an epoxide functionality of at least one, (ii) 1 to 55 weight percent of at least one epoxide hardener, (iii) 5 to 50 weight percent of an essentially halogen-free fire-retardant system that includes a mixture of: (1) at least one compound selected from the group comprising alkaline earth metal hydroxides and aluminium group hydroxides, and (2) at least one phosphorous-containing material, (iv) 10 to 60 weight percent of a filler system capable of reducing the density of the precursor that includes a mixture of (1) at least one low-density inorganic filler having a density of between 0.1 to 0.5 g cm¿-3?, (2)at least one low-density organic filler having a density of between 0.01 to 0.30 g/cm¿-3? and being compressible.

    Abstract translation: 本发明涉及阻燃，低密度和基本上无卤素的环氧组合物的可固化前体，其包含（i）10至70重量％的至少一种环氧官能度为至少一个的有机环氧化合物，（ ii）1至55重量％的至少一种环氧化物硬化剂，（iii）5至50重量％的基本上不含卤素的阻燃体系，其包括以下混合物：（1）至少一种选自以下的化合物： 碱土金属氢氧化物和铝基氢氧化物，和（2）至少一种含磷材料，（iv）10至60重量％的能够降低前体密度的填料体系，其包括（1）在 至少一种密度为0.1至0.5g / cm 3 -3的低密度无机填料，（2）至少一种密度为0.01至0.30g / cm 3 -3的低密度有机填料， 并且是可压缩的。

    ULTRA-LIGHT EPOXY COMPOSITION
    8.
    发明申请
    ULTRA-LIGHT EPOXY COMPOSITION 审中-公开

    公开(公告)号：WO2022229760A1

    公开(公告)日：2022-11-03

    申请号：PCT/IB2022/053327

    申请日：2022-04-08

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： ELGIMIABI, Sohaib

    IPC: C08G59/22 ,  C08G59/24 ,  C08G59/54 ,  C08G59/62 ,  C08K7/20 ,  C08G59/46 ,  C08L63/00 ,  C09D163/00

    Abstract: In one aspect of the present disclosure, there is provided a low-density curable composition precursor, comprising (a) a first part (A) comprising: (i) at least one polymeric diamine; (b) a second part (B) comprising: (i) at least one epoxy resin; (ii) at least one reactive diluent; (iii) at least one amide selected from polyamide waxes; wherein part (A) and/or part (B) comprise a low density filler material having a density of less than 0.3 g/cc; and wherein the curable composition obtained by combining part (A) and part (B) has a cured density according to DIN 53479A of less than 0.5 g/cc.

    FAST CURING OIL TOLERANT ADHESIVE COMPOSITIONS
    9.
    发明申请
    FAST CURING OIL TOLERANT ADHESIVE COMPOSITIONS 审中-公开

    公开(公告)号：WO2021019488A1

    公开(公告)日：2021-02-04

    申请号：PCT/IB2020/057201

    申请日：2020-07-30

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： ELGIMIABI, Sohaib ,  KOCH, Bernhard H.

    IPC: C08G59/50 ,  C08G59/54 ,  C08G59/56 ,  C09J163/00

    Abstract: A curable adhesive composition precursor comprising a first part (A) comprising: at least one diamine in an amount of from 10 to 50 wt.-% based on the total weight of part (A), at least one amine epoxy curing agent based on a phenolic lipid in an amount of from 10 to 50 wt.-% based on the total weight of part (A), and at least one inorganic filler material in an amount of from 10 to 60 wt.-% based on the total amount of part (A); and a second part (B) comprising: at least one first epoxy resin in an amount of from 15 to 60 wt.-% based on the total amount of part (B)), at least one viscosity modifier in an amount of from 1 to 25 wt.-%, based on the total weight of part (B), and at least one epoxy-reactive flexibilizer in an amount of from 0.1 to 10 wt.-% based on the total amount of part (B).

Patent Agency Ranking