FLEXIBLE THERMOELECTRIC DEVICE
    4.
    发明申请

    公开(公告)号:WO2021112873A1

    公开(公告)日:2021-06-10

    申请号:PCT/US2019/064957

    申请日:2019-12-06

    Abstract: The present disclosure relates to a method of fabricating a thermoelectric device. The method includes disposing a metal layer on a dielectric layer to form a sub-assembly, forming patterned circuits on the metal layer, forming blind vias in the dielectric layer, fabricating first thermoelectric elements in a first series of blind vias, and fabricating second thermoelectric elements in a second series of blind vias to form thermoelectric units with the first thermoelectric elements and the patterned circuits. The sub-assembly is configured to be joined to an adjacent sub-assembly along a first direction, and the first and second thermoelectric elements of each thermoelectric unit are aligned in a second direction substantially perpendicular to the first direction. The present disclosure further relates to a thermoelectric device which includes a plurality of thermoelectric units forming a strip extending in a first direction.

    SOLAR ENERGY ABSORBING AND RADIATIVE COOLING ARTICLES AND METHODS

    公开(公告)号:WO2021224699A1

    公开(公告)日:2021-11-11

    申请号:PCT/IB2021/053157

    申请日:2021-04-16

    Abstract: Passive cooling articles may include a first element defining a high absorbance in an atmospheric infrared wavelength range and a high average reflectance in a solar wavelength range. The first element may define a first major surface (114, 214, 314, 414) positioned and shaped to reflect solar energy in the solar wavelength range to an energy absorber (108, 208, 308, 408, 508, 608) spaced a distance from the first major surface (114, 214, 314, 414). The energy absorber (108, 208, 308, 408, 508, 608) may be a heating panel or a photovoltaic cell. A second element may define a high thermal conductivity and thermally coupled to a second major surface (116, 216, 416) of the first element to transfer thermal energy from the second element to the first element to cool the second element.

    A THERMOELECTRIC MODULE
    10.
    发明申请

    公开(公告)号:WO2021112874A1

    公开(公告)日:2021-06-10

    申请号:PCT/US2019/064964

    申请日:2019-12-06

    Abstract: The present disclosure relates to a stacked thermoelectric module and a method for manufacturing the same. The thermoelectric module comprises a lower thermoelectric unit, an upper thermoelectric unit, a first connector and a second connector. The lower thermoelectric unit comprises lower first and second thermoelectric elements electrically connected at a bottom side of the lower thermoelectric unit. The upper thermoelectric unit comprises upper first and second thermoelectric elements electrically connected at a top side of the upper thermoelectric unit. The first connector comprises a conducting material disposed between the upper first thermoelectric element and the lower second thermoelectric element, wherein the upper first thermoelectric element is directly above the first conductor. The second connector comprises the conducting material disposed between the upper second thermoelectric element and the lower first thermoelectric element, wherein the upper second thermoelectric element is directly above the second conductor.

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