公开(公告)号：WO2014143662A1

公开(公告)日：2014-09-18

申请号：PCT/US2014/027567

申请日：2014-03-14

Applicant: APPLIED MATERIALS, INC

Inventor： WEAVER, William T. ,  DANIEL, JR., Malcolm N. ,  VOPAT, Robert B. ,  SCHALLER, Jason M. ,  NEWMAN, Jacob ,  KANAWADE, Dinesh ,  CONSTANT, Andrew J. ,  HICKERSON, Stephen C. ,  HUDGENS, Jeffrey C. ,  FREEMAN, Marvin L.

IPC: H01L21/677 ,  B65G49/07 ,  B25J9/04 ,  H01L21/205

CPC classification number: B25J9/1682 ,  B25J9/043 ,  B25J11/0095 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742 ,  Y10S901/29 ,  Y10T74/20305

Abstract: Electronic device processing systems are described. The system includes a mainframe housing having a transfer chamber, a first facet, a second facet opposite the first facet, a third facet, and a fourth facet opposite the third facet, a first carousel assembly coupled to a first facet, a second carousel assembly coupled to the third facet, a first load lock coupled to the second facet, a second load lock coupled to the fourth facet, and a robot adapted to operate in the transfer chamber to exchange substrates from the first and second carousels. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects.

Abstract translation: 描述电子设备处理系统。 该系统包括主体壳体，其具有传送室，第一小面，与第一小面相对的第二小面，第三小面和与第三小面相对的第四小面，耦合到第一小面的第一旋转木马组件，第二转盘组件 耦合到第三小面，耦合到第二小面的第一负载锁定，耦合到第四小面的第二负载锁和适于在传送室中操作以从第一和第二转盘交换衬底的机器人。 还有许多其他方面描述了用于传输基底的方法和多轴机器人。