公开(公告)号：WO2020251696A1

公开(公告)日：2020-12-17

申请号：PCT/US2020/030744

申请日：2020-04-30

Applicant: APPLIED MATERIALS, INC.

Inventor： LERNER, Alexander N. ,  SHAVIV, Roey ,  KARAZIM, Michael P. ,  MORAES, Kevin Vincent ,  SANSONI, Steven V. ,  CONSTANT, Andrew J. ,  BRODINE, Jeffrey Allen ,  VELLORE, Kim Ramkumar ,  SADE, Amikam ,  KUMAR, Niranjan

IPC: C23C16/54 ,  C23C16/02 ,  C23C16/04 ,  C23C16/40 ,  C23C14/56 ,  C23C14/12 ,  C23C28/00 ,  H01L21/67 ,  H01L31/0256

Abstract: Embodiments of the present disclosure generally relate to a processing system for forming one or more layers of a photodiode. In one embodiment, the processing system includes a transfer chamber, a plurality of processing chambers, and a controller configured to cause a process to be performed in the processing system. The process includes performing a pre-clean process on a substrate, aligning and placing a first mask on the substrate, depositing a first layer on the substrate, and depositing a second layer on the substrate. The processing system can form layers of a photodiode in a low defect, cost effective, and high utilization manner.