SEMICONDUCTOR PROCESSING CHAMBERS AND METHODS FOR CLEANING THE SAME

    公开(公告)号:WO2021021542A1

    公开(公告)日:2021-02-04

    申请号:PCT/US2020/043197

    申请日:2020-07-23

    Abstract: A processing chamber may include a gas distribution member, a substrate support, and a pumping liner. The gas distribution member and the substrate support may at least in part define a processing volume. The pumping liner may define an internal volume in fluid communication with the processing volume via a plurality of apertures of the pumping liner circumferentially disposed about the processing volume. The processing chamber may further include a flow control mechanism operable to direct fluid flow from the internal volume of the pumping liner into the processing volume via a subset of the plurality of apertures of the pumping liner during fluid distribution into the processing volume from the gas distribution member.

    SEMICONDUCTOR PROCESSING CHAMBER AND METHODS FOR CLEANING THE SAME

    公开(公告)号:WO2021021518A1

    公开(公告)日:2021-02-04

    申请号:PCT/US2020/043082

    申请日:2020-07-22

    Abstract: A processing chamber may include a gas distribution member, a metal ring member below the gas distribution member, and an isolating assembly coupled with the metal ring member and isolating the metal ring member from the gas distribution member. The isolating assembly may include an outer isolating member coupled with the metal ring member. The outer isolating member may at least in part define a chamber wall. The isolating assembly may further include an inner isolating member coupled with the outer isolating member. The inner isolating member may be disposed radially inward from the metal ring member about an central axis of the processing chamber. The inner isolating member may define a plurality of openings configured to provide fluid access into a radial gap between the metal ring member and the inner isolating member.

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