公开(公告)号：WO2018022520A3

公开(公告)日：2018-02-01

申请号：PCT/US2017/043551

申请日：2017-07-24

Applicant: APPLIED MATERIALS, INC.

Inventor： NAGENGAST, Andrew J. ,  LEE, Christopher Heung-Gyun ,  LI, Thomas ,  IYER, Anand N. ,  DIAO, Jie ,  ZHANG, Huanbo ,  RONDUM, Erik S. ,  LEE, Wei-Cheng ,  OH, Jeonghoon

IPC: B24B37/32 ,  H01L21/687 ,  B24B37/04 ,  H01L21/306

Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.

公开(公告)号：WO2013074706A1

公开(公告)日：2013-05-23

申请号：PCT/US2012/065127

申请日：2012-11-14

Applicant: APPLIED MATERIALS, INC

Inventor： CHANG, Shou-Sung ,  CHEN, Hung Chih ,  KARUPPIAH, Lakshmanan ,  BUTTERFIELD, Paul D. ,  RONDUM, Erik S.

IPC: H01L21/304 ,  H01L21/66

CPC classification number: B24B37/013 ,  B24B49/16

Abstract: Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage, a side force measurement instrument coupled to the upper carriage, and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

Abstract translation: 提供了用于抛光衬底的方法，装置和系统。 本发明包括上压板; 耦合到上压板的扭矩/应变测量仪器; 以及耦合到扭矩/应变测量仪器并适于驱动上压板旋转通过扭矩/应变测量仪器的下压板。 在其他实施例中，本发明包括上托架，耦合到上滑架的侧力测量装置和联接到侧力测量仪器并适于支撑抛光头的下托架。 公开了许多附加方面。

公开(公告)号：WO2023283525A1

公开(公告)日：2023-01-12

申请号：PCT/US2022/073324

申请日：2022-06-30

Applicant: APPLIED MATERIALS, INC.

Inventor： WISWELL, Nicholas A. ,  RONDUM, Erik S. ,  CHERIAN, Benjamin ,  POURMAND, Sohrab ,  OSTERHELD, Thomas ,  GURUSAMY, Jay ,  CHANG, Shou-Sung

IPC: B24B49/12 ,  B24B37/005 ,  B24B47/12 ,  B24D11/02

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system comprising an acoustic window having a top surface to contact the substrate, and a controller configured to detect a polishing endpoint based on received acoustic signals from the in-situ acoustic monitoring system.

公开(公告)号：WO2018022520A2

公开(公告)日：2018-02-01

申请号：PCT/US2017/043551

申请日：2017-07-24

Applicant: APPLIED MATERIALS, INC.

Inventor： NAGENGAST, Andrew J. ,  LEE, Christopher Heung-Gyun ,  LI, Thomas ,  IYER, Anand N. ,  DIAO, Jie ,  ZHANG, Huanbo ,  RONDUM, Erik S. ,  LEE, Wei-Cheng ,  OH, Jeonghoon

IPC: B24B37/32 ,  H01L21/687 ,  B24B37/04 ,  H01L21/306

Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.

Abstract translation: 保持环包括大致环形的本体，该本体具有限定基底和底表面的内表面，该底表面具有从外表面延伸到内表面的多个通道，以及多个 所述岛由所述通道隔开并且提供接触区域以接触抛光垫，其中所述接触面积为所述底面的平面面积的约15-40％。

公开(公告)号：WO2010062661A3

公开(公告)日：2010-06-03

申请号：PCT/US2009/062439

申请日：2009-10-28

Applicant: APPLIED MATERIALS, INC. ,  BONNER, Benjamin A. ,  PRABHU, Gopalakrishna B. ,  RONDUM, Erik S. ,  MENK, Gregory E. ,  IYER, Anand N. ,  MCREYNOLDS, Peter ,  LEUNG, Garlen C.

Inventor： BONNER, Benjamin A. ,  PRABHU, Gopalakrishna B. ,  RONDUM, Erik S. ,  MENK, Gregory E. ,  IYER, Anand N. ,  MCREYNOLDS, Peter ,  LEUNG, Garlen C.

IPC: H01L21/304

Abstract: A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt.