Abstract:
A method and apparatus are provided for etching semiconductor and dielectric substrates through the use of plasmas based on mixtures of a first gas having the formula CaFb, and a second gas having the formula CxHyFz, wherein a/b >/= 2/3, and wherein x/z >/= 1/2. The mixtures may be used in low or medium density plasmas sustained in a magnetically enhanced reactive ion chamber to provide a process that exhibits excellent corner layer selectivity, photo resist selectivity, under layer selectivity, and profile and bottom CD control. The percentages of the first and second gas may be varied during etching to provide a plasma that etches undoped oxide films or to provide an etch stop on such films.
Abstract translation:提供了一种方法和装置,用于通过使用基于具有式CaFb的第一气体的混合物的等离子体和具有式C x H y F z的第二气体来蚀刻半导体和介电衬底,其中a / b> / = 2/3,和 其中x / z> / = 1/2。 混合物可以用于在磁增强反应离子室中维持的低或中等密度等离子体,以提供显示出优异的角层选择性,光刻抗蚀剂选择性,底层选择性以及轮廓和底部CD控制的方法。 在蚀刻期间可以改变第一和第二气体的百分比,以提供蚀刻未掺杂的氧化物膜的等离子体或在这种膜上提供蚀刻停止。
Abstract:
Additive manufacturing of an object includes dispensing a plurality of successive layers of powder over a top surface of a platform, fusing an object region in each of the plurality of successive layers to form the object, and fusing a brace region in a particular layer from the plurality of layers to form a brace structure to inhibit lateral motion of the powder. The brace structure is spaced apart from the particular object region by a gap of unfused powder.
Abstract:
A method of additive manufacturing to form a component comprises successively depositing a plurality of layers to form the component. Depositing at least one of the plurality of layers includes depositing a layer of a first particulate precursor over a platen, depositing a second particulate precursor on portions of the platen over the layer of the first particulate precursor specified by a controller, and directing energy to the second particulate precursor deposited on the portion of the platen to cause an exothermic chemical reaction between the first particulate precursor and the second particulate precursor. The exothermic chemical reaction produces heat that sinters products of the chemical reaction to fabricate the layer of the component.