SELF-ALIGNED CONTACT ETCH WITH HIGH SENSITIVITY TO NITRIDE SHOULDER
    1.
    发明申请
    SELF-ALIGNED CONTACT ETCH WITH HIGH SENSITIVITY TO NITRIDE SHOULDER 审中-公开
    自对准的接触蚀刻剂,具有高灵敏度到硝酸盐

    公开(公告)号:WO03052808A2

    公开(公告)日:2003-06-26

    申请号:PCT/US0239906

    申请日:2002-12-12

    CPC classification number: H01L21/76897 H01J37/3266 H01L21/31116

    Abstract: A method and apparatus are provided for etching semiconductor and dielectric substrates through the use of plasmas based on mixtures of a first gas having the formula CaFb, and a second gas having the formula CxHyFz, wherein a/b >/= 2/3, and wherein x/z >/= 1/2. The mixtures may be used in low or medium density plasmas sustained in a magnetically enhanced reactive ion chamber to provide a process that exhibits excellent corner layer selectivity, photo resist selectivity, under layer selectivity, and profile and bottom CD control. The percentages of the first and second gas may be varied during etching to provide a plasma that etches undoped oxide films or to provide an etch stop on such films.

    Abstract translation: 提供了一种方法和装置,用于通过使用基于具有式CaFb的第一气体的混合物的等离子体和具有式C x H y F z的第二气体来蚀刻半导体和介电衬底,其中a / b> / = 2/3,和 其中x / z> / = 1/2。 混合物可以用于在磁增强反应离子室中维持的低或中等密度等离子体,以提供显示出优异的角层选择性,光刻抗蚀剂选择性,底层选择性以及轮廓和底部CD控制的方法。 在蚀刻期间可以改变第一和第二气体的百分比,以提供蚀刻未掺杂的氧化物膜的等离子体或在这种膜上提供蚀刻停止。

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