公开(公告)号：WO2023030814A1

公开(公告)日：2023-03-09

申请号：PCT/EP2022/071819

申请日：2022-08-03

Applicant: ASML NETHERLANDS B.V.

Inventor： MENG, Xiaodong ,  KANG, Zhiwen ,  ZHANG, Jian ,  QIU, Kangsheng

IPC: G03F7/20

Abstract: Systems, apparatuses, and methods for detecting a location of a positioned sample may include an electrostatic holder configured to hold a sample and form a gap area between an outside edge of the sample and a structure of the electrostatic holder when the electrostatic holder holds the sample, wherein the gap area is coated with a first coating configured to reflect a first wavelength of light with first brightness and to reflect a second wavelength of the light with second brightness, the first wavelength is within a predetermined range of wavelengths, the second wavelength is outside the predetermined range of wavelengths, and the first brightness is higher than the second brightness; a light source configured to direct the light at the gap area; and an optical detector configured to image the light reflected off the gap area.

公开(公告)号：WO2021037827A1

公开(公告)日：2021-03-04

申请号：PCT/EP2020/073704

申请日：2020-08-25

Applicant: ASML NETHERLANDS B.V.

Inventor： WANG, Yixiang ,  LIU, Shibing ,  CAO, Shanhui ,  QIU, Kangsheng ,  DOU, Juying ,  LUO, Ying ,  LI, Yinglong ,  LI, Qiang ,  VAN DER WILK, Ronald ,  VAN DER TOORN, Jan-Gerard, Cornelis

IPC: H01J37/317 ,  H01J37/20 ,  H01L21/683

Abstract: Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.