公开(公告)号：WO2021185939A1

公开(公告)日：2021-09-23

申请号：PCT/EP2021/056890

申请日：2021-03-18

Applicant: ASML NETHERLANDS B.V.

Inventor： WANG, Yixiang ,  LIU, Shibing ,  LUO, Ying

IPC: H01J37/20 ,  H01L21/683

Abstract: An electrostatic chuck control system configured to be utilized during an inspection process of a wafer, the electrostatic chuck control system comprising an electrostatic chuck of a stage configured to be undocked during the inspection process, wherein the electrostatic chuck comprises a plurality of components configured to influence an interaction between the wafer and the electrostatic chuck during the inspection process, a first sensor configured to generate measurement data between at least some of the plurality of components and the wafer, and a controller including circuitry configured to receive the measurement data to determine characteristics of the wafer relative to the electrostatic chuck and to generate adjustment data to enable adjusting, while the stage is undocked, at least some of the plurality of components based on the determined characteristics.

公开(公告)号：WO2019063528A1

公开(公告)日：2019-04-04

申请号：PCT/EP2018/075926

申请日：2018-09-25

Applicant: ASML NETHERLANDS B.V.

Inventor： ZHANG, Jian ,  KANG, Zhiwen ,  WANG, Yixiang

IPC: G02B21/02 ,  H01J37/22

Abstract: An objective lens for forming an image of an object. The objective lens includes, sequentially from an image side to an object side, a first lens group having negative refractive power, and a second lens group having positive refractive power.

公开(公告)号：WO2019063433A1

公开(公告)日：2019-04-04

申请号：PCT/EP2018/075621

申请日：2018-09-21

Applicant: ASML NETHERLANDS B.V.

Inventor： ZHANG, Jian ,  KANG, Zhiwen ,  WANG, Yixiang

IPC: H01J37/22 ,  H01J37/244 ,  H01J37/30

Abstract: An optical height detection system in a charged particle beam inspection system. The optical height detection system includes a projection unit including a modulated illumination source, a projection grating mask including a projection grating pattern, and a projection optical unit for projecting the projection grating pattern to a sample; and a detection unit including a first detection grating mask including a first detection grating pattern, a second detection grating mask including a second detection grating pattern, and a detection optical system for forming a first grating image from the projection grating pattern onto the first detection grating mask and forming a second grating image from the projection grating pattern onto the second detection grating masks. The first and second detection grating patterns at least partially overlap the first and second grating images, respectively.

公开(公告)号：WO2022128846A1

公开(公告)日：2022-06-23

申请号：PCT/EP2021/085372

申请日：2021-12-13

Applicant: ASML NETHERLANDS B.V.

Inventor： YE, Ning ,  JIANG, Jun ,  ZHANG, Jian ,  WANG, Yixiang

IPC: H01J37/22 ,  H01J37/26 ,  H01J37/28

Abstract: Apparatuses, systems, and methods for providing beams for controlling charges on a sample surface of charged particle beam system. In some embodiments, a module comprising a laser source configured to emit a beam. The beam may illuminate an area adjacent to a pixel on a wafer to indirectly heat the pixel to mitigate a cause of a direct photon-induced effect at the pixel. An electron beam tool configured to detect a defect in the pixel, wherein the defect is induced by the indirect heating of the pixel.

公开(公告)号：WO2021023752A1

公开(公告)日：2021-02-11

申请号：PCT/EP2020/071942

申请日：2020-08-04

Applicant: ASML NETHERLANDS B.V.

Inventor： ZHANG, Jian ,  YE, Ning ,  KANG, Zhiwen ,  WANG, Yixiang

IPC: H01J37/02 ,  H01J37/28

Abstract: A system and a method for manipulating a beam of an Advanced Charge Controller module (560) in different planes in an e-beam system are provided. Some embodiments of the system include a lens system configured to manipulate a beam in the tangential plane and the sagittal plane such that the beam spot is projected onto the wafer with high luminous energy. Some embodiments of the system include a lens system comprising at least two cylindrical lens (510, 512).

公开(公告)号：WO2020126963A1

公开(公告)日：2020-06-25

申请号：PCT/EP2019/085233

申请日：2019-12-16

Applicant: ASML NETHERLANDS B.V.

Inventor： VAN DER TOORN, Jan-Gerard, Cornelis ,  HUINCK, Jeroen, Gertruda, Antonius ,  SEVERT, Han, Willem, Hendrik ,  KOOIKER, Allard, Eelco ,  RONDE, Michaël, Johannes, Christiaan ,  WELLINK, Arno, Maria ,  LIU, Shibing ,  LUO, Ying ,  WANG, Yixiang ,  CHEN, Chia-Yao ,  ZHU, Bohang ,  VAN SOEST, Jurgen

IPC: G03F7/20 ,  H01J37/00 ,  H01J37/20

Abstract: Disclosed is an object table for holding an object, comprising: an electrostatic clamp arranged to clamp the object on the object table; a neutralizer arranged to neutralize a residual charge of the electrostatic clamp; a control unit arranged to control the neutralizer, wherein the residual charge is an electrostatic charge present on the electrostatic clamp when no voltage is applied to the electrostatic clamp.

公开(公告)号：WO2022069274A1

公开(公告)日：2022-04-07

申请号：PCT/EP2021/075767

申请日：2021-09-20

Applicant: ASML NETHERLANDS B.V.

Inventor： WANG, Yan ,  ZHANG, Jian ,  KANG, Zhiwen ,  WANG, Yixiang

IPC: G03F9/00 ,  H01J37/28 ,  H01J37/147 ,  H01J37/20 ,  H01J37/21 ,  H01J37/22 ,  H01J37/29 ,  H01J37/304 ,  H01J37/317 ,  G01B11/06

Abstract: An inspection apparatus for adjusting a working height for a substrate for multiple target heights is disclosed. The inspection apparatus includes a radiation source configured to provide a radiation beam and a beam splitter configured to split the radiation beam into multiple beamlets that each reflect off a substrate. Each beamlet contains light of multiple wavelengths. The inspection apparatus includes multiple light reflecting components, wherein each light reflecting component is associated with one of the beamlets reflecting off the substrate and is configured to support a different target height for the substrate by detecting a height or a levelness of the substrate based on the beamlet reflecting off the substrate.

公开(公告)号：WO2021180473A1

公开(公告)日：2021-09-16

申请号：PCT/EP2021/054623

申请日：2021-02-25

Applicant: ASML NETHERLANDS B.V.

Inventor： ZHANG, Jian ,  WANG, Yan ,  TANG, Ljiang ,  WANG, Yixiang

IPC: H01J37/20 ,  G01B11/06 ,  H01J37/21 ,  H01J37/22 ,  H01J37/26 ,  H01J37/28 ,  H01J37/29

Abstract: An improved leveling sensor and method for adjusting a sample height in a charged-particle beam inspection system are disclosed. An improved leveling sensor comprises a light source configured to project a first pattern onto a sample and a detector configured to capture an image of a projected pattern after the first pattern is projected on the sample. The first pattern can comprise an irregularity to enable a determination of a vertical displacement of the sample.

公开(公告)号：WO2021037827A1

公开(公告)日：2021-03-04

申请号：PCT/EP2020/073704

申请日：2020-08-25

Applicant: ASML NETHERLANDS B.V.

Inventor： WANG, Yixiang ,  LIU, Shibing ,  CAO, Shanhui ,  QIU, Kangsheng ,  DOU, Juying ,  LUO, Ying ,  LI, Yinglong ,  LI, Qiang ,  VAN DER WILK, Ronald ,  VAN DER TOORN, Jan-Gerard, Cornelis

IPC: H01J37/317 ,  H01J37/20 ,  H01L21/683

Abstract: Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.

公开(公告)号：WO2020136012A1

公开(公告)日：2020-07-02

申请号：PCT/EP2019/084827

申请日：2019-12-12

Applicant: ASML NETHERLANDS B.V.

Inventor： FANG, Jie ,  WANG, Yixiang ,  ZHANG, Qirong ,  ZHANG, Haojie ,  YANG, Jinmei ,  ZHU, Fenghui

IPC: H01J37/09

Abstract: A method of manufacturing an aperture device includes forming a first layer (510) on a first side of a base layer (500). The base layer may be part of a substrate including a plurality of layers. The method also includes forming a second layer (515) on the first layer. A material of the second layer includes metal. The method also includes forming an opening (516) in the second layer, forming an opening (511) in the first layer by etching, removing the second layer, and forming an opening (505) in the base layer by electrochemical etching. The method may include dry etching of the first layer.