METHOD, APPARATUS, AND SYSTEM FOR WAFER GROUNDING

    公开(公告)号:WO2021037827A1

    公开(公告)日:2021-03-04

    申请号:PCT/EP2020/073704

    申请日:2020-08-25

    Abstract: Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.

    VALVES WITH REDUCED PARTICLE GENERATION AND INCREASED CYCLE LIFE

    公开(公告)号:WO2023083574A1

    公开(公告)日:2023-05-19

    申请号:PCT/EP2022/079038

    申请日:2022-10-19

    Abstract: Systems with valves that increase cycle life and reduce particle generation. Embodiments may include a first movable member (413), a second movable member (411), and a third movable member (415); a first link (412_1, 412_2) coupled to the first movable member and the second movable member such that when the second movable member is moved laterally and the third movable member is stopped, the first link exerts a force on the first movable member that causes the first movable member to move towards a surface (409) and press against the surface to form a vacuum seal; and a second link ( 412_3) coupled to the first movable member and the third movable member such that when the first link causes the first movable member to move, the second link exerts a force on the first movable member that limits movement of the first movable member such that the first movable member moves towards the surface with limited offset.

    ELECTRON EMITTER AND METHOD OF FABRICATING SAME
    4.
    发明申请
    ELECTRON EMITTER AND METHOD OF FABRICATING SAME 审中-公开
    电子发射器及其制造方法

    公开(公告)号:WO2018029018A1

    公开(公告)日:2018-02-15

    申请号:PCT/EP2017/069270

    申请日:2017-07-31

    Abstract: Electron emitters and methods of fabricating the electron emitters are disclosed. According to certain embodiments, an electron emitter includes a tip with a planar region having a diameter in a range of approximately (0.05-10) micrometers. The electron emitter tip is configured to release field emission electrons. The electron emitter further includes a work-function-lowering material coated on the tip.

    Abstract translation: 公开了电子发射体和制造电子发射体的方法。 根据某些实施例,电子发射器包括具有直径在大约(0.05-10)微米范围内的平面区域的尖端。 电子发射器尖端被配置为释放场致发射电子。 电子发射器还包括涂覆在尖端上的功函降低材料。

Patent Agency Ranking