MEASURING METHOD AND MEASURING APPARATUS
    3.
    发明申请

    公开(公告)号:WO2021089319A1

    公开(公告)日:2021-05-14

    申请号:PCT/EP2020/079514

    申请日:2020-10-20

    Abstract: Apparatus and method for measuring one or more parameters of a substrate (300) using source radiation emitted from a radiation source (100) and directed onto the substrate. The apparatus comprises at least one reflecting element (710a) and at least one detector (720, 721). The at least one reflecting element is configured to receive a reflected radiation resulting from reflection of the source radiation from the substrate and further reflect the reflected radiation into a further reflected radiation. The at least one detector is configured for measurement of the further reflected radiation for determination of at least an alignment of the source radiation and/or the substrate

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