Abstract:
A fluid handling structure for a lithographic apparatus configured to contain immersion fluid to a region, the fluid handling structure having, at a boundary of a space: at least one gas knife opening in a radially outward direction of the space; and at least one gas supply opening in the radially outward direction of the at least gas knife opening relative to the space. The gas knife opening and the gas supply opening both provide substantially pure CO 2 gas so as to provide a substantially pure CO 2 gas environment adjacent to, and radially outward of, the space.
Abstract:
An immersion lithography apparatus has a controller (500) configured to control a substrate table (WT) to move along an exposure route including in order: an entry motion (R2) in which the substrate moves from an off-substrate position at which the immersion space (10) does not overlap the substrate (W) to an on-substrate position at which the immersion space at least partially overlaps the substrate, a transfer motion (R3, R4) in which the substrate table changes speed and/or direction and moves for at least a transfer time after the substrate moves to the on-substrate position, and an expose motion in which the substrate is scanned and the patterned beam is projected onto the substrate, wherein throughout the transfer motion at least a part of the immersion space overlaps the substrate and wherein the patterned bean is not projected onto the substrate during the entry motion and the transfer motion.