公开(公告)号：WO2023076900A1

公开(公告)日：2023-05-04

申请号：PCT/US2022/078657

申请日：2022-10-25

Applicant: ATIEVA, INC.

Inventor： SHAO, Bai ,  BACH, Eric Magnus ,  HAWKINS, James ,  HUNG, Shun-Cheng ,  LEE, Cheng-Hung ,  CHIEN, Yung-Chuan ,  MU, Mingkai

IPC: H01L23/40 ,  H01L25/00 ,  H01L23/36 ,  H01L25/10

Abstract: A device may include a plurality of power chips arranged in a first row in a first plane and being electrically coupled to a printed circuit board, the first plane being non- parallel to a plane of the printed circuit board. A device may include a plurality of power chips arranged in a second row in a second plane and being electrically coupled to the printed circuit board, the second plane being non-parallel to the plane of the printed circuit board and non-parallel to the first plane.

公开(公告)号：WO2022178534A1

公开(公告)日：2022-08-25

申请号：PCT/US2022/070724

申请日：2022-02-18

Applicant: ATIEVA, INC.

Inventor： HAWKINS, James ,  RAMASWAMY, Pablo ,  BACH, Eric Magnus ,  GOLOZAR, Mehdi

IPC: H01M10/48 ,  H01M10/613 ,  H01M10/625 ,  H01M10/647 ,  H01M10/6554

Abstract: A battery module comprises: electrochemical cells arranged side by side in an array of multiple rows and columns, the electrochemical cells including terminals that comprise a first terminal at respective first ends of the electrochemical cells and at least portions of second terminals at the respective first ends; a housing that holds the electrochemical cells, the housing formed by a molding process with a polymer material; and a planar busbar extending along the terminals throughout the array, the planar busbar joined to the housing by an overmolding operation during the molding process without an adhesive between the planar busbar and the housing.

公开(公告)号：WO2023076941A1

公开(公告)日：2023-05-04

申请号：PCT/US2022/078705

申请日：2022-10-26

Applicant: ATIEVA, INC.

Inventor： SHAO, Bai ,  BACH, Eric Magnus ,  HAWKINS, James ,  HUNG, Shun-Cheng ,  LEE, Cheng-Hung ,  CHIEN, Yung-Chuan ,  MU, Mingkai

IPC: H01M50/502 ,  H01M10/48 ,  B60L50/64

Abstract: A vehicle may include a plurality of separate and distinct electrical busbars that are electrically isolated from each other. A device may include a polymer overmold material that mechanically couples the separate and distinct electrical busbars to each other in a single integrated multi-busbar unit, wherein the overmold material is provided to the busbars through an injection molding process. A device may include a flex printed circuit board having a plurality of sensors that is coupled to the single integrated multi-busbar unit, wherein the sensors are coupled to the distinct electrical busbars when the flex printed circuit board is coupled to the integrated busbar unit.