公开(公告)号：WO2014008891A2

公开(公告)日：2014-01-16

申请号：PCT/DE2013100255

申请日：2013-07-10

Applicant: CURAMIK ELECTRONICS GMBH

Inventor： MEYER ANDREAS ,  WEHE CHRISTOPH ,  SCHULZ-HARDER JUERGEN

IPC: H01L23/373

CPC classification number: H01L23/3735 ,  H01L23/3731 ,  H01L23/473 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19106 ,  H01L2924/00014

Abstract: The invention relates to a metal-ceramic substrate having a plurality of layers forming a substrate body, said layers lying one on top of the other in the manner of a stack and being connected face-to-face to form the substrate body and at least one of the layers consisting of a ceramics material, having at least one outer metallization that is provided on at least one surface face of the substrate body and is structured into order to form regions forming conductor tracks, contact areas and/or fastening areas for components, and having a cooler structure that is formed by at least one flow channel or cooling channel through which a cooling medium, preferably a liquid cooling medium, can flow.

Abstract translation: 金属 - 陶瓷具有多个基板本体形成层，其被一个堆叠在另一个之上并彼此连接表面到基板主体，和其中至少一个由陶瓷制成的基材，具有至少一个外金属化设置于所述基板主体的和，以形成至少一个表面侧 在导体接触表面和/或形成用于成分的区域，以及具有被至少一个通过其形成的冷却结构附接表面构造的冷却介质，优选为液体冷却介质流或冷却管道。