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    COOLING DEVICE FOR DISSIPATING THERMAL LOSSES FROM AN ELECTRIC OR ELECTRONIC COMPONENT OR A SUB-ASSEMBLY AND COOLER
    2.
    发明申请
    COOLING DEVICE FOR DISSIPATING THERMAL LOSSES FROM AN ELECTRIC OR ELECTRONIC COMPONENT OR A SUB-ASSEMBLY AND COOLER 审中-公开
    COOLER去除热量的电气或电子元件或组件和冷却器的损失

    公开(公告)号：WO2005015633A3

    公开(公告)日：2005-03-17

    申请号：PCT/DE2004001441

    申请日：2004-07-06

    Applicant: CURAMIK ELECTRONICS GMBH ,  SCHULZ-HARDER JUERGEN ,  EXEL KARL ,  BAUMEISTER INGO

    Inventor： SCHULZ-HARDER JUERGEN ,  EXEL KARL ,  BAUMEISTER INGO

    IPC: H01L23/473 ,  H01L23/367

    CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The invention relates to a novel device for dissipating the thermal losses of an electric or electronic component or a sub-assembly to a remote external cooler. Said device comprises a coolant circuit between the component or sub-assembly and the external cooler. The circuit contains at least one primary cooler that is traversed by the coolant and absorbs the thermal losses of the component or sub-assembly and at least one secondary cooler in the external cooler that is traversed by the coolant, said secondary cooler comprising a plurality of cooling fins.

    Abstract translation: 本发明涉及一种用于从电气或电子组件的去除废热或装配到空间远程外部冷却器的新颖装置，与所述部件或组件和具有至少一个通流冷却剂初级辐射器的外部冷凝器的冷却剂回路，用于接收之间所提供的 该部件的或组件的热损失和具有至少一个通流在外部冷却器冷却剂第二散热器，其中，所述二次冷却器多个冷却肋。

    METHOD FOR PRODUCING HOLLOW BODIES, PARTICULARLY FOR COOLERS, HOLLOW BODY AND COOLER CONTAINING ELECTRICAL AND/OR ELECTRONIC COMPONENTS
    4.
    发明申请
    METHOD FOR PRODUCING HOLLOW BODIES, PARTICULARLY FOR COOLERS, HOLLOW BODY AND COOLER CONTAINING ELECTRICAL AND/OR ELECTRONIC COMPONENTS 审中-公开
    用于生产空心体，特别是冷却器，中空和凉爽含电气或电子元件

    公开(公告)号：WO2014026675A2

    公开(公告)日：2014-02-20

    申请号：PCT/DE2013100290

    申请日：2013-08-12

    Applicant: CURAMIK ELECTRONICS GMBH

    Inventor： SCHULZ-HARDER JUERGEN

    IPC: H01L23/373

    CPC classification number: H01L23/3735 ,  H01L23/3736 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Method for producing hollow bodies, particularly for coolers, with at least two metal layers arranged by stacking to create a stack and connected to one another via at least one connecting or bond layer, and with at least one cavity formed inside the stack and produced by structuring at least one metal layer, wherein a layer made of a bonding material is applied before the stack is created to at least one of the surface sides of the metal layers adjoining one another in the stack, and is formed after the stack is created into the bond layer connecting the metal layers.

    Abstract translation: 一种用于生产中空体的方法，特别是散热器，通过堆叠成堆叠和至少一个连接或接合层互连金属层和具有至少一个堆叠空腔内形成，其通过图案化的至少一个金属层形成布置有至少两个， 堆垛层上的至少一个由彼此相邻的堆叠中的施加之前，金属层的各表面侧上，粘结材料构成的层，并且其中连接粘结层的金属层被转换为堆垛形成。

    THERMOELECTRIC GENERATOR MODULE, METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SUCH A METAL-CERAMIC SUBSTRATE
    5.
    发明申请
    THERMOELECTRIC GENERATOR MODULE, METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SUCH A METAL-CERAMIC SUBSTRATE 审中-公开
    热电发电机模块，用于制造这样的金属陶瓷基片金属陶瓷基片和方法

    公开(公告)号：WO2013113311A3

    公开(公告)日：2013-10-03

    申请号：PCT/DE2013100020

    申请日：2013-01-22

    Applicant: CURAMIK ELECTRONICS GMBH

    Inventor： MEYER ANDREAS ,  SCHULZ-HARDER JUERGEN

    IPC: H01L35/32

    CPC classification number: H05K1/0306 ,  C04B37/021 ,  C04B37/026 ,  C04B37/028 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/406 ,  C04B2237/407 ,  C04B2237/64 ,  C04B2237/706 ,  C04B2237/86 ,  H01L23/38 ,  H01L35/30 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/11 ,  H05K3/0067 ,  H05K2201/06 ,  H05K2201/10219 ,  Y10T29/49155 ,  H01L2924/00

    Abstract: The invention relates to a thermoelectric generator module with a hot zone (1a) and a cold zone (1b) comprising at least a first metal-ceramic substrate (2), which has a first ceramic layer (6) and at least one structured first metallization (4) applied to the first ceramic layer (6) and is assigned to the hot zone, and at least a second metal-ceramic substrate (4), which has a second ceramic layer (7) and at least one structured second metallization (5) applied to the second ceramic layer and is assigned to the cold zone (1b), and also a number of thermoelectric generator components (N, P) located between the first and second structured metallizations (4, 5) of the metal-ceramic substrates (2, 3). Particularly advantageously, the first metal-ceramic substrate (2), assigned to the hot zone (1a), has at least one layer of steel or high-grade steel (8), wherein the first ceramic layer (6) is arranged between the first structured metallization (4) and the at least one layer of steel or high-grade steel (8). The invention also relates to an associated metal-ceramic substrate and to a method for producing it.

    Abstract translation: 本发明涉及一种具有热和冷区的热电发生器模块（1A，1B），包括至少一个第一，与金属陶瓷基片（2）与第一陶瓷层相关联的所述热区（6）和所述第一陶瓷层上的至少一个（6） 施加的，图案化的第一金属化（4）和至少一个第二，冷区域（1B）相关联的与所述金属陶瓷基片（4）与第二陶瓷层（7）和至少一个施加至所述第二陶瓷层，所述图案化的第二金属化（5）以及 在金属 - 陶瓷衬底（2,3）的第一和第二图案化金属化部（4，5）之间接收的多个热电发生器部件（N，P）。 特别有利的是，第一，在金属陶瓷基片相关联的热区域（1A）（2）钢或不锈钢层中的至少一个（8），其中第一陶瓷层（6）的第一图案化金属（4）和所述的至少一个之间 钢或不锈钢层（8）被布置。 此外，本发明的主题是相关的金属陶瓷基底及其制造方法。

    THERMOELECTRIC GENERATOR MODULE, METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SUCH A METAL-CERAMIC SUBSTRATE
    7.
    发明申请
    THERMOELECTRIC GENERATOR MODULE, METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SUCH A METAL-CERAMIC SUBSTRATE 审中-公开
    热电发电机模块，用于制造这样的金属陶瓷基片金属陶瓷基片和方法

    公开(公告)号：WO2013113311A4

    公开(公告)日：2013-11-28

    申请号：PCT/DE2013100020

    申请日：2013-01-22

    Applicant: CURAMIK ELECTRONICS GMBH

    Inventor： MEYER ANDREAS ,  SCHULZ-HARDER JUERGEN

    IPC: H01L35/32

    CPC classification number: H05K1/0306 ,  C04B37/021 ,  C04B37/026 ,  C04B37/028 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/406 ,  C04B2237/407 ,  C04B2237/64 ,  C04B2237/706 ,  C04B2237/86 ,  H01L23/38 ,  H01L35/30 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/11 ,  H05K3/0067 ,  H05K2201/06 ,  H05K2201/10219 ,  Y10T29/49155 ,  H01L2924/00

    Abstract: The invention relates to a thermoelectric generator module with a hot zone (1a) and a cold zone (1b) comprising at least a first metal-ceramic substrate (2), which has a first ceramic layer (6) and at least one structured first metallization (4) applied to the first ceramic layer (6) and is assigned to the hot zone, and at least a second metal-ceramic substrate (4), which has a second ceramic layer (7) and at least one structured second metallization (5) applied to the second ceramic layer and is assigned to the cold zone (1b), and also a number of thermoelectric generator components (N, P) located between the first and second structured metallizations (4, 5) of the metal-ceramic substrates (2, 3). Particularly advantageously, the first metal-ceramic substrate (2), assigned to the hot zone (1a), has at least one layer of steel or high-grade steel (8), wherein the first ceramic layer (6) is arranged between the first structured metallization (4) and the at least one layer of steel or high-grade steel (8). The invention also relates to an associated metal-ceramic substrate and to a method for producing it.

    Abstract translation: 本发明涉及一种具有热和冷区的热电发生器模块（1A，1B），包括至少一个第一，与金属陶瓷基片（2）与第一陶瓷层相关联的所述热区（6）和所述第一陶瓷层上的至少一个（6） 施加的，图案化的第一金属化（4）和至少一个第二，冷区域（1B）相关联的与所述金属陶瓷基片（4）与第二陶瓷层（7）和至少一个施加至所述第二陶瓷层，所述图案化的第二金属化（5）以及 在第一和第二金属化之间的更结构化的（4,5）的金属 - 陶瓷基片（2,3）记录，热电发电机部件（N，P）。 特别有利的是，第一，在金属陶瓷基片相关联的热区域（1A）（2）钢或不锈钢层中的至少一个（8），其中第一陶瓷层（6）的第一图案化金属（4）和所述的至少一个之间 钢或不锈钢层（8）布置。 本发明的另一主题是一个辅助，金属陶瓷基片及其制造方法。

    METAL-CERAMIC SUBSTRATE
    8.
    发明申请
    METAL-CERAMIC SUBSTRATE 审中-公开
    金属陶瓷基片

    公开(公告)号：WO2014008891A2

    公开(公告)日：2014-01-16

    申请号：PCT/DE2013100255

    申请日：2013-07-10

    Applicant: CURAMIK ELECTRONICS GMBH

    Inventor： MEYER ANDREAS ,  WEHE CHRISTOPH ,  SCHULZ-HARDER JUERGEN

    IPC: H01L23/373

    CPC classification number: H01L23/3735 ,  H01L23/3731 ,  H01L23/473 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19106 ,  H01L2924/00014

    Abstract: The invention relates to a metal-ceramic substrate having a plurality of layers forming a substrate body, said layers lying one on top of the other in the manner of a stack and being connected face-to-face to form the substrate body and at least one of the layers consisting of a ceramics material, having at least one outer metallization that is provided on at least one surface face of the substrate body and is structured into order to form regions forming conductor tracks, contact areas and/or fastening areas for components, and having a cooler structure that is formed by at least one flow channel or cooling channel through which a cooling medium, preferably a liquid cooling medium, can flow.

    Abstract translation: 金属 - 陶瓷具有多个基板本体形成层，其被一个堆叠在另一个之上并彼此连接表面到基板主体，和其中至少一个由陶瓷制成的基材，具有至少一个外金属化设置于所述基板主体的和，以形成至少一个表面侧 在导体接触表面和/或形成用于成分的区域，以及具有被至少一个通过其形成的冷却结构附接表面构造的冷却介质，优选为液体冷却介质流或冷却管道。

    METHOD FOR THE PRODUCTION OF PELTIER MODULES, AND PELTIER MODULE
    9.
    发明申请
    METHOD FOR THE PRODUCTION OF PELTIER MODULES, AND PELTIER MODULE 审中-公开
    的生产方法Peltier模块和珀尔贴模型

    公开(公告)号：WO2007098736A2

    公开(公告)日：2007-09-07

    申请号：PCT/DE2007000342

    申请日：2007-02-20

    Applicant: CURAMIK ELECTRONICS GMBH ,  SCHULZ-HARDER JUERGEN

    Inventor： SCHULZ-HARDER JUERGEN

    IPC: H01L35/08 ,  H01L35/34

    CPC classification number: H01L35/34 ,  H01L35/08

    Abstract: The invention relates to a method for producing Peltier modules, each of which comprises several Peltier elements that are arranged between at least two substrates. The substrates are made of an electrically insulating material at least on the sides facing the Peltier elements while being provided with contact areas on said surfaces. The contact areas, to which the Peltier elements are connected by means of terminal surfaces during the production process, are formed by metallic areas.

    Abstract translation: 本发明涉及一种用于珀耳帖模块，每个模块具有多个设置在至少两个基板珀耳帖元件之间的制造方法，其中，所述基材至少包括在其面对的电绝缘材料的珀耳帖元件侧面和与金属此表面侧 形成的接触表面区域设置，与该珀耳帖元件串联连接在垫的制造。

    COOLING SYSTEM FOR ELECTRONIC DEVICES AND DEVICE WITH SUCH A COOLING SYSTEM
    10.
    发明申请
    COOLING SYSTEM FOR ELECTRONIC DEVICES AND DEVICE WITH SUCH A COOLING SYSTEM 审中-公开
    具有这种冷却系统的电子设备和设备的冷却系统

    公开(公告)号：WO2005088429A3

    公开(公告)日：2005-10-27

    申请号：PCT/DE2005000246

    申请日：2005-02-14

    Applicant: CURAMIK ELECTRONICS GMBH ,  SCHULZ-HARDER JUERGEN ,  WILLER BERND

    Inventor： SCHULZ-HARDER JUERGEN ,  WILLER BERND

    IPC: G06F1/20 ,  H01L23/40 ,  H01L23/473 ,  H05K7/20

    CPC classification number: H05K7/20272 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The invention relates to a novel cooling system for electronic components in an electronic device, for example a computer or a PC, whereby the cooling system comprises at least one cooler (5), for fixing to a component (2) for cooling, in a closed circuit for a liquid cooling medium and further components connected, for example, by means of hose lines (8, 9, 11) such as at least one heat exchanger unit (13) for fixing to a ventilation opening in a device housing (4), comprising at least one heat exchanger (10, 10a, 10b), at least one reservoir (6) for the liquid cooling medium and at least one circulating pump (7).

    Abstract translation: 本发明涉及一种新的冷却系统，用于电子设备的电气组件，诸如计算机或PC，其中，在用于液体冷却介质的至少一个封闭回路中的冷却系统，以被紧固到该部件被冷却（2），冷却器（5），和 更多例如 经由软管线（8,9，11）相关联的组件，例如一个装置外壳（4）的通风孔中的至少一个附接至热交换器单元（13）与至少一个热交换器（10，10A，10B），至少一个存储箱（6）液体为 有冷却介质和至少一个循环泵（7）。

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