公开(公告)号：WO2014169154A1

公开(公告)日：2014-10-16

申请号：PCT/US2014/033701

申请日：2014-04-10

Applicant: DCG SYSTEMS, INC. ,  DESLANDES, Herve

Inventor： DESLANDES, Herve

IPC: H04N7/18 ,  G01R31/302 ,  G01R33/12

CPC classification number: G01R31/2648 ,  G01R15/246 ,  G01R31/311

Abstract: A method for emission testing of a semiconductor device (DUT), by mounting the DUT onto an test bench of an emission tester, the emission tester having an optical detector; electrically connecting the DUT to an electrical tester; applying electrical test signals to the DUT while keeping test parameters constant; serially inserting one of a plurality of shortpass filters into an optical path of the emission tester and collecting emission test signal from the optical detector until all available shortpass filters have been inserted into the optical path; determining appropriate shortpass filter providing highest signal to noise ratio of the emission signal; inserting the appropriate shortpass filter into the optical path; and,performing emission testing on the DUT.

Abstract translation: 一种通过将DUT安装到发射测试仪的测试台上的半导体器件（DUT）的发射测试方法，发射测试仪具有光学检测器; 将DUT电连接到电气测试仪; 将电测试信号施加到DUT，同时保持测试参数不变; 将多个短路滤波器中的一个串联插入到发射测试器的光路中，并收集来自光学检测器的发射测试信号，直到所有可用的短路滤波器已插入光路中; 确定提供发射信号的最高信噪比的适当短路滤波器; 将适当的短路滤波器插入光路; 并对DUT进行发射测试。

公开(公告)号：WO2011156527A1

公开(公告)日：2011-12-15

申请号：PCT/US2011/039679

申请日：2011-06-08

Applicant: DCG SYSTEMS, INC. ,  FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. ,  ALTMANN, Frank ,  SCHMIDT, Christian ,  SCHLANGEN, Rudolf ,  DESLANDES, Herve

Inventor： ALTMANN, Frank ,  SCHMIDT, Christian ,  SCHLANGEN, Rudolf ,  DESLANDES, Herve

IPC: G01N25/72

CPC classification number: G01J5/0066 ,  G01J2005/0077 ,  G01J2005/0085 ,  G01N1/00 ,  G01N21/35 ,  G01N21/88 ,  G01N25/00 ,  G01N2021/8461 ,  G01R31/311

Abstract: A non-destructive approach for the 3D localization of buried hot spots in electronic device architectures by use of Lock-in Thermography (LIT). The 3D analysis is based on the principles of thermal wave propagation through different material layers and the resulting phase shift/thermal time delay. With more complex multi level stacked die architectures it is necessary to acquire multiple LIT results at different excitation frequencies for precise hot spot depth localization. Additionally, the use of multiple time -resolved thermal waveforms, measured in a minimized field of view on top of the hot spot location, can be used to speed up the data acquisition. The shape of the resulting waveforms can be analyzed to further increase the detection accuracy and confidence level.

Abstract translation: 通过使用锁定热成像（LIT）在电子设备架构中对埋藏热点的3D定位的非破坏性方法。 3D分析基于通过不同材料层的热波传播的原理以及由此产生的相移/热时间延迟。 使用更复杂的多级堆叠管芯结构，需要在不同的激发频率下获取多个LIT结果，以实现精确的热点深度定位。 此外，可以使用在热点位置顶部的最小化视场中测量的多个时间分辨热波形，以加速数据采集。 可以分析所得波形的形状，以进一步提高检测精度和置信度。

公开(公告)号：WO2014093122A1

公开(公告)日：2014-06-19

申请号：PCT/US2013/073299

申请日：2013-12-05

Applicant: DCG SYSTEMS, INC. ,  DESLANDES, Herve

Inventor： DESLANDES, Herve

IPC: G01R31/311

CPC classification number: H01L27/14806 ,  G01J3/14 ,  G01J3/2803 ,  G01R31/311

Abstract: An optical detector is disclosed, having a plurality of detector cells, each detector cell comprising a light sensor, a charge accumulator, and a switch interposed between the light sensor and the charge accumulator; wherein the light sensor produces electrical current when illuminated by electromagnetic radiation, the charge accumulator accumulate electric charge when receiving the electrical current generated by the light sensor, and the switch is configured to controllably electrically isolate or connect the charge accumulator to light sensor, such that the charge accumulator accumulates charge only when electrically connected by the switch to the light sensor.

Abstract translation: 公开了一种具有多个检测器单元的光学检测器，每个检测器单元包括光传感器，电荷累加器和插在光传感器和电荷累加器之间的开关; 其中光传感器在被电磁辐射照射时产生电流，当接收到由光传感器产生的电流时，电荷累加器累积电荷，并且开关被配置为可控制地电隔离或连接电荷累加器到光传感器，使得 电荷累加器仅在通过开关电连接到光传感器时才积累电荷。