公开(公告)号：WO2005054371A3

公开(公告)日：2005-08-11

申请号：PCT/JP2004018093

申请日：2004-11-29

Applicant: DOW CORNING TORAY SILICONE ,  DOW CORNING ASIA LTD ,  YOSHITAKE MAKOTO ,  NAKANISHI KOJI ,  NAKASHIMA HISATAKA ,  KOBAYASHI HIDEKI ,  MURAKAMI MASASHI ,  TAKEUCHI KASUMI

Inventor： YOSHITAKE MAKOTO ,  NAKANISHI KOJI ,  NAKASHIMA HISATAKA ,  KOBAYASHI HIDEKI ,  MURAKAMI MASASHI ,  TAKEUCHI KASUMI

IPC: G02B1/04 ,  C08L83/04 ,  C08L83/05 ,  C08L83/07

CPC classification number: C08L83/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08L83/00

Abstract: An addition-curable organopolysiloxane resin composition having, in a state of cued body, a hardness of 60 to 100 at 25 degree C and 40 to 100 at 150 degree C as measued in accordance with the provisions of ASTM D2240-86, said composition comprising: (A) 100 parts by weight of an organopolysiloxane resin comprised of at least alkenyl groups and phenyl groups; (B) 10 to 50 parts by weight of an organooligosiloxane comprised of at least alkeyl groups and phenyl groups; (C) 20 to 100 parts by weight of an organohydrogenoligosiloxane or organohydrogenpolysiloxane; and (D) an addition-reaction catalyst in a catalytic quantity; an optical material that is comprised of a cured body producted from aforementioned components (A), (B), and (C) and posseses the aforementioned characteristics.

Abstract translation: 根据ASTM D2240-86的规定测量，加热固化的有机聚硅氧烷树脂组合物具有在固体状态下在25℃和150℃下硬度为60至100，所述组合物包含 ：（A）100重量份由至少烯基和苯基组成的有机聚硅氧烷树脂; （B）10-50重量份至少包含烯基和苯基的有机低聚硅氧烷; （C）20至100重量份的有机氢低聚硅氧烷或有机氢聚硅氧烷; 和（D）催化量的加成反应催化剂; （A），（B）和（C）制造的具有上述特征的固化体构成的光学材料。

公开(公告)号：WO0208335A3

公开(公告)日：2002-06-06

申请号：PCT/US0123301

申请日：2001-07-24

Applicant: DOW CORNING ,  DOW CORNING ASIA LTD

Inventor： BREWER CHRISTOPHER M ,  CHORVATH IGOR ,  LEE MICHAEL K ,  LEE YONGJUN ,  LI DAWEI ,  NAKANISHI KOJI ,  OLDINSKI ROBERT L ,  PETROFF LENIN J ,  RABE RICHARD L ,  ROMENESKO DAVID J

IPC: C08J3/24 ,  C08K3/16 ,  C08L77/00 ,  C08L77/02 ,  C08L77/06 ,  C08L83/04

CPC classification number: C08L77/02 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/26 ,  C08G77/44 ,  C08G77/445 ,  C08G77/448 ,  C08G77/455 ,  C08G77/458 ,  C08G77/46 ,  C08L77/00 ,  C08L77/06 ,  C08L83/04 ,  Y10S525/903 ,  C08L83/00 ,  C08L2666/14

Abstract: A method for preparing a thermoplastic elastomer is disclosed, said method comprising (I) mixing, (A) a rheologically stable polyamide resin having a melting point or glass transition temperature of 25 DEG C to 275 DEG C, (B) a silicone base comprising (B') 100 parts by weight of a diorganopolysiloxane gum having a plasticity of at least 30 and having an average of at least 2 alkenyl groups in its molecule and (B'') 5 to 200 parts by weight of a reinforcing filler, the weight ratio of said silicone base to said polyamide resin being greater than 35:65 to 85:15, (C) a compatibilizer selected from (I) a coupling agent, (ii) a functional diorganopolysiloxane or (iii) a copolymer comprising at least one diorganopolysiloxane block and at least one block selected from polyamide, polyether, polyurethane, polyurea, polycarbonate or polyacrylate, (D) and organohydrido silicon compound which contains ac average of at least 2 silicon-bonded hydrogen groups in its molecule and (E) a hydrosilation catalyst, components (D) and (E) being present in an amount sufficient to cure said diorganopolysiloxane (B'); and (II) dynamically curing said diorganopolysiloxane (B').

Abstract translation: 公开了一种制备热塑性弹性体的方法，所述方法包括（I）混合（A）熔点或玻璃化转变温度为25℃至275℃的流变学稳定的聚酰胺树脂，（B）包含 （B'）100重量份的可塑性为至少30的二有机聚硅氧烷胶，其分子中平均具有至少2个烯基，（B“）为5〜200重量份的增强填料， 所述硅氧烷基与所述聚酰胺树脂的重量比大于35:65至85:15，（C）选自（I）偶联剂，（ii）官能二有机聚硅氧烷或（iii）至少包含 一个二有机聚硅氧烷嵌段和至少一个选自聚酰胺，聚醚，聚氨酯，聚脲，聚碳酸酯或聚丙烯酸酯的嵌段，（D）和有机氢化硅化合物，其在分子中含有至少2个与硅键合的氢基团，和（E）a 硅氢化 催化剂，组分（D）和（E）以足以固化所述二有机聚硅氧烷（B'）的量存在; 和（II）动态固化所述二有机聚硅氧烷（B'）。

公开(公告)号：WO0172903A3

公开(公告)日：2002-02-14

申请号：PCT/US0108959

申请日：2001-03-21

Applicant: DOW CORNING ,  DOW CORNING ASIA LTD

Inventor： CHORVATH IGOR ,  LEE MICHAEL ,  LI DAWEI ,  NAKANISHI KOJI ,  LEE YONGJUN ,  OLDINSKI ROBERT L ,  RABE RICHARD L ,  ROMENESKO DAVID J ,  SAGE JEFFREY P

IPC: C08J3/24 ,  C08K5/13 ,  C08K5/541 ,  C08L77/00 ,  C08L83/04 ,  C08L83/07

CPC classification number: C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/44 ,  Y10S525/903 ,  C08L2666/14 ,  C08L2666/28

Abstract: A method for preparing a thermoplastic elastomer is disclosed, said method comprising (I) mixing (A) a rheologically stable polyamide resin having a melting point or glass transition temperature of 25 DEG C to 275 DEG C, (B) a silicone base comprising (B') 100 parts by weight of a diorganopolysiloxane gum having a plasticity of at least 30 and having an average of at least 2 alkenyl radicals in its molecule and (B'') 5 to 200 parts by weight of a reinforcing filler, the weight ratio of said silicone base to said polyamide resin being greater than 35:65 to 85:15, (C) 0.1 to 5 parts by weight of a hindered phenol compound for each 100 parts by weight of said polyamide and said silicone base, (D) an organohydrido silicon compound which contains an average of at least 2 siliconbonded hydrogen groups in its molecule and (E) a hydrosilation catalyst, components (D) and (E) being present in an amount sufficient to cure said diorganopolysiloxane (B'); and (II) dynamically curing said diorganopolysiloxane (B'), wherein at least one property of the thermoplastic elastomer selected from tensile strength or elongation is at least 25 % greater than the respective property for a corresponding simple blend wherein said diorganopolysiloxane is not cured and said thermoplastic elastomer has an elongation of at least 25 %.

Abstract translation: 公开了一种制备热塑性弹性体的方法，所述方法包括（I）混合（A）熔点或玻璃化转变温度为25℃至275℃的流变学稳定的聚酰胺树脂，（B）包含（ B'）100重量份的塑性为至少30的二有机聚硅氧烷胶，其分子中平均具有至少2个烯基，（B“）5至200重量份的增强填料，重量 所述硅氧烷基与所述聚酰胺树脂的比例大于35:65至85:15，（C）每100重量份所述聚酰胺和所述硅氧烷基（D）为0.1至5重量份的受阻酚化合物 ）在其分子中平均含有至少2个硅键合氢基团的有机氢化硅化合物和（E）氢化硅烷化催化剂，组分（D）和（E）以足以固化所述二有机聚硅氧烷（B'）的量存在; 和（II）动态固化所述二有机聚硅氧烷（B'），其中选自拉伸强度或伸长率的热塑性弹性体的至少一种性能比相应的简单混合物的相应性能大至少25％，其中所述二有机聚硅氧烷不固化， 所述热塑性弹性体的伸长率至少为25％。

公开(公告)号：WO2005062080A3

公开(公告)日：2006-03-02

申请号：PCT/JP2004019469

申请日：2004-12-17

Applicant: DOW CORNING TORAY CO LTD ,  YOSHITAKE MAKOTO ,  NAKANISHI KOJI ,  MURAKAMI MASASHI ,  TAKEUCHI KASUMI

Inventor： YOSHITAKE MAKOTO ,  NAKANISHI KOJI ,  MURAKAMI MASASHI ,  TAKEUCHI KASUMI

IPC: C08L83/04 ,  C08L83/05 ,  C08L83/07 ,  G02B1/04

CPC classification number: G02B1/04 ,  C08G77/12 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08L83/04 ,  C08L83/00

Abstract: Addition-curable organopolysiloxane resin composition comprising an organopolysiloxane resin that contains at least alkenyl, hydroxyl, and phenyl directly bonded to silicon of which at least 30 mole% is phenyl; an organohydrogenoligosiloxane or organohydrogenpolysiloxane that contains at least phenyl directly bonded to silicon of which at least 20 mole% is phenyl; and an addition reaction-curing catalyst.

Abstract translation: 包含有机聚硅氧烷树脂的可加成固化的有机聚硅氧烷树脂组合物，其至少含有至少30摩尔％为苯基的硅的键合，羟基和苯基; 至少包含至少20摩尔％的苯的直接键合至苯基的有机氢氢化二硅氧烷或有机氢聚硅氧烷; 和加成反应固化催化剂。