公开(公告)号：WO03001246A3

公开(公告)日：2003-07-24

申请号：PCT/US0143281

申请日：2001-11-20

Applicant: EMCORE CORP

Inventor： ANDERSON GENE R ,  ARMENDARIZ MARCELINO G ,  BRYAN ROBERT P ,  CARSON RICHARD F ,  CHU DAHWEY ,  DUCKETT EDWIN B III ,  MCCORMICK FREDERICK B ,  MITCHELL ROBERT T ,  PETERSON DAVID W ,  REYSEN BILL H

IPC: G02B6/26 ,  G02B6/42

CPC classification number: G02B6/4239 ,  G02B6/266 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/4207 ,  G02B6/421 ,  G02B6/4212 ,  G02B6/4221 ,  G02B6/4224 ,  G02B6/4227 ,  G02B6/4249 ,  G02B6/426 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4286 ,  G02B6/4292

Abstract: This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an optoelectronic connector. The optoelectronic connector comprises: (1) a mounting structure; (2) an array of optoelectronic devices adapted to the mounting structure, the optoelectronic devices having at least a first end; (3) an array of optical elements, the array of optical elements having at least a first end; (4) the first end of the array of optical elements proximate to the first end of the array of optoelectronic devices in such a manner that one or more optical elements is positioned relative to one or more optoelectronic devices; and (5) a heat spreader passing along a surface of a head region of the mounting structure. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the head spreader. Optoelectronic devices may be adapted to the head spreader in such a manner that the devices are accessible through the window in the mounting structure.

Abstract translation: 本发明涉及一种光发射机，接收机或收发机模块，更具体地说，涉及光电连接器。 光电连接器包括：（1）安装结构; （2）适于安装结构的光电子器件的阵列，所述光电器件具有至少第一端; （3）光学元件阵列，所述光学元件阵列至少具有第一端; （4）靠近光电子器件阵列的第一端的光学元件阵列的第一端，使得一个或多个光学元件相对于一个或多个光电子器件定位; 和（5）沿安装结构的头部区域的表面通过的散热器。 安装结构可以是柔性印刷电路板。 头部区域中的热通孔或热管可以将热量从安装结构传递到散热器。 散热器可以为热区域提供机械刚度或刚度。 在另一个实施例中，电触点和接地平面可以沿着头部区域的表面通过，以便提供到光电子器件的电接触路径并限制电磁干扰。 在另一个实施例中，可以在安装结构的头部区域中形成窗口，以便提供对头部扩张器的接近。 光电子器件可以以这样的方式适用于头吊架，即，可以通过安装结构中的窗口来访问设备。

公开(公告)号：WO02052324A9

公开(公告)日：2003-05-01

申请号：PCT/US0143279

申请日：2001-11-20

Applicant: EMCORE CORP

Inventor： ANDERSON GENE R ,  ARMENDARIZ MARCELINO G ,  BRYAN ROBERT P ,  CARSON RICHARD F ,  CHU DAHWEY ,  DUCKETT EDWIN B III ,  GIUNTA RACHEL KNUDSEN ,  MITCHELL ROBERT T ,  MCCORMICK FREDERICK B ,  PETERSON DAVID W ,  RISING MERIDETH A ,  REBER CATHLEEN A ,  REYSEN BILL H

IPC: G02B6/26 ,  G02B6/36 ,  G02B6/38 ,  G02B6/42

CPC classification number: G02B6/4277 ,  G02B6/266 ,  G02B6/3885 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/4207 ,  G02B6/421 ,  G02B6/4212 ,  G02B6/4219 ,  G02B6/4227 ,  G02B6/4239 ,  G02B6/4249 ,  G02B6/426 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4286

Abstract: A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following steps: (1) holding at least one optical element close to at least one optoelectronic device, at least one optical element having at least a first end; (2) aligning at least one optical element with at least one optoelectronic device; (3) depositing a first non-opaque material on a first end of at least one optoelectronic device; and (4) bringing the first end of at least one optical element proximate to the first end of at least one optoelectronic device in such a manner that the first non-opaque material contacts the first end of at least one optoelectronic device and the first end of at least one optical element. The optical element may be an optical fiber (114), and the optoelectronic device may be a vertical cavity surface emitting laser (116). The first non-opaque material (106) may be a UV optical adhesive that provides an optical path and mechanical stability. In another embodiment of the alignment process, the first end of at least one optical element is brought proximate to the first end of at least one optoelectronic device in such a manner that an interstitial space exists between the first end of at least one optoelectronic device and the first end of at least one optical element. This interstitial space is then filled with a non-opaque material after aligning of the optical element and the optoelectronic device.

Abstract translation: 提供了一种用于将至少一根光纤对准和连接到至少一个光电器件的工艺，以便在至少一个光纤与至少一个光电器件之间耦合光。 该方法的一个实施例包括以下步骤：（1）保持靠近至少一个光电子器件的至少一个光学元件，至少一个具有至少第一端的光学元件; （2）将至少一个光学元件与至少一个光电器件对准; （3）在至少一个光电器件的第一端上沉积第一不透明材料; 和（4）使至少一个光学元件的第一端靠近至少一个光电子器件的第一端，使得第一不透明材料接触至少一个光电器件的第一端，而第一端 的至少一个光学元件。 光学元件可以是光纤（114），并且光电子器件可以是垂直腔表面发射激光器（116）。 第一不透明材料（106）可以是提供光路和机械稳定性的UV光学粘合剂。 在对准过程的另一实施例中，使至少一个光学元件的第一端靠近至少一个光电子器件的第一端，使得在至少一个光电器件的第一端和 至少一个光学元件的第一端。 然后在对准光学元件和光电子器件之后，用非不透明材料填充该间隙空间。

公开(公告)号：WO02052324A3

公开(公告)日：2003-01-09

申请号：PCT/US0143279

申请日：2001-11-20

Applicant: EMCORE CORP

Inventor： ANDERSON GENE R ,  ARMENDARIZ MARCELINO G ,  BRYAN ROBERT P ,  CARSON RICHARD F ,  CHU DAHWEY ,  DUCKETT EDWIN B III ,  GIUNTA RACHEL KNUDSEN ,  MITCHELL ROBERT T ,  MCCORMICK FREDERICK B ,  PETERSON DAVID W ,  RISING MERIDETH A ,  REBER CATHLEEN A ,  REYSEN BILL H

IPC: G02B6/26 ,  G02B6/36 ,  G02B6/38 ,  G02B6/42

CPC classification number: G02B6/4277 ,  G02B6/266 ,  G02B6/3885 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/4207 ,  G02B6/421 ,  G02B6/4212 ,  G02B6/4219 ,  G02B6/4227 ,  G02B6/4239 ,  G02B6/4249 ,  G02B6/426 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4286

Abstract: A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following steps: (1) holding at least one optical element close to at least one optoelectronic device, at least one optical element having at least a first end; (2) aligning at least one optical element with at least one optoelectronic device; (3) depositing a first non-opaque material on a first end of at least one optoelectronic device; and (4) bringing the first end of at least one optical element proximate to the first end of at least one optoelectronic device in such a manner that the first non-opaque material contacts the first end of at least one optoelectronic device and the first end of at least one optical element. The optical element may be an optical fiber (114), and the optoelectronic device may be a vertical cavity surface emitting laser (116). The first non-opaque material (106) may be a UV optical adhesive that provides an optical path and mechanical stability. In another embodiment of the alignment process, the first end of at least one optical element is brought proximate to the first end of at least one optoelectronic device in such a manner that an interstitial space exists between the first end of at least one optoelectronic device and the first end of at least one optical element. This interstitial space is then filled with a non-opaque material after aligning of the optical element and the optoelectronic device.

Abstract translation: 提供了一种过程，用于将至少一根光纤对准并连接到至少一个光电子器件，以便在至少一根光纤和至少一个光电子器件之间耦合光。 该方法的一个实施例包括以下步骤：（1）将至少一个光学元件保持靠近至少一个光电子器件，至少一个光学元件具有至少第一端; （2）将至少一个光学元件与至少一个光电子器件对准; （3）在至少一个光电子器件的第一端上沉积第一非不透明材料; 和（4）使至少一个光学元件的第一端接近至少一个光电子器件的第一端，使得第一非不透明材料接触至少一个光电子器件的第一端，并且第一端 的至少一个光学元件。 光学元件可以是光纤（114），并且光电子器件可以是垂直腔表面发射激光器（116）。 第一非透明材料（106）可以是提供光路和机械稳定性的UV光学粘合剂。 在对准过程的另一个实施例中，至少一个光学元件的第一端部以至少一个光电子器件的第一端部与至少一个光电子器件的第一端部之间存在间隙空间的方式靠近至少一个光电子器件的第一端部， 至少一个光学元件的第一端。 然后在光学元件和光电子器件对准之后，这种间隙空间被填充非透明材料。