公开(公告)号：WO2014144180A1

公开(公告)日：2014-09-18

申请号：PCT/US2014/028479

申请日：2014-03-14

Applicant: ENTHONE INC.

Inventor： LI, Jingye ,  ABYS, Joseph A. ,  KUDRAK, JR., Edward

IPC: C25D3/46 ,  C25D7/00 ,  C25D15/00 ,  H01L23/495 ,  C25D3/64

CPC classification number: C25D15/00 ,  C25D3/46 ,  C25D3/64 ,  C25D7/00 ,  H01R13/03

Abstract: Electrolytic plating compositions and electrolytic plating processes for the co-deposition of silver or silver alloy with fluoropolymer nanoparticles are provided. The silver or silver alloy composite coating containing fluoropolymer nanoparticles has enhanced functional properties such as a reduced coefficient of friction. The electrolytic plating composition comprises: (a) a silver ion source comprising silver methane sulfonate (Ag-MSA); (b) a complexing agent comprising a compound comprising a nitrogen-containing heterocyclic ring; (c) a pre-mix dispersion comprising fluoropolymer nanoparticles particles having a mean particle size of from about 10 nm and about 500 nm and a surfactant; and (d) an auxiliary surfactant comprising a cationic fluorosurfactant, wherein the composition has a pH of from about 8 to about 14.

Abstract translation: 提供了电解电镀组合物和用于与含氟聚合物纳米颗粒共沉积银或银合金的电解电镀方法。 含有氟聚合物纳米颗粒的银或银合金复合涂层具有增强的功能性能，例如降低的摩擦系数。 电解电镀组合物包括：（a）包含甲磺酸银（Ag-MSA）的银离子源; （b）络合剂，其包含含有含氮杂环的化合物; （c）包含平均粒径为约10nm至约500nm的含氟聚合物纳米粒子的预混合分散体和表面活性剂; 和（d）包含阳离子含氟表面活性剂的辅助表面活性剂，其中所述组合物的pH为约8至约14。

公开(公告)号：WO2009076430A1

公开(公告)日：2009-06-18

申请号：PCT/US2008/086210

申请日：2008-12-10

Applicant: ENTHONE INC. ,  ABYS, Joseph, A. ,  KUDRAK, Edward, J., Jr. ,  LI, Jingye ,  XU, Chen ,  FAN, Chonglun

Inventor： ABYS, Joseph, A. ,  KUDRAK, Edward, J., Jr. ,  LI, Jingye ,  XU, Chen ,  FAN, Chonglun

IPC: C25D9/02 ,  C25D3/00 ,  C25D19/00

CPC classification number: C25D15/02 ,  C25D3/02 ,  C25D15/00

Abstract: A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface.

Abstract translation: 提供了一种赋予衬底表面的耐腐蚀性的方法。 该方法包括使基板的表面与电解电镀溶液接触，所述电解电镀溶液包括（a）选自锌，钯，银，镍，铜，金，铂，铑等的沉积金属的沉积金属离子源， 钌，铬及其合金，（b）非金属纳米颗粒的预混合分散体，其中所述非金属颗粒在其上具有表面活性剂分子的预混合涂层; 以及将外部电子源施加到所述电解电镀溶液中，从而将包含所述沉积金属和非金属纳米颗粒的金属基复合涂层电沉积到所述表面上。

公开(公告)号：WO2009076424A1

公开(公告)日：2009-06-18

申请号：PCT/US2008/086203

申请日：2008-12-10

Applicant: ENTHONE INC. ,  ABYS, Joseph, A. ,  LI, Jingye ,  KUDRAK, Edward, J., Jr. ,  XU, Chen

Inventor： ABYS, Joseph, A. ,  LI, Jingye ,  KUDRAK, Edward, J., Jr. ,  XU, Chen

IPC: C25D7/06 ,  H01L21/44 ,  B05D1/36

CPC classification number: C25D15/02 ,  C25D3/30 ,  H01R13/03

Abstract: There is provided a method and composition for applying a composite coating having enhanced resistance to tin whisker formation onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.

Abstract translation: 提供了一种用于将具有增强的耐锡晶须形成的复合涂层施加到电气部件的金属表面上的方法和组合物。 该方法包括使金属表面与包含（a）锡离子源和（b）非金属颗粒的电解电镀组合物接触，并将外部电子源施加到电解镀覆组合物，从而将复合涂层电解沉积到 金属表面，其中复合涂层包括锡金属和非金属颗粒。