公开(公告)号：WO2020076603A1

公开(公告)日：2020-04-16

申请号：PCT/US2019/054472

申请日：2019-10-03

Applicant: FACEBOOK TECHNOLOGIES, LLC

Inventor： BRODOCEANU, Daniel ,  SAKETI, Pooya ,  MAY, Alexander, Udo ,  MARTINS AMARAL, Thiago ,  HUGHES, Patrick, Joseph ,  MOH, Karsten ,  TORRENTS, Abad, Oscar

IPC: H01L33/00 ,  H01L21/683 ,  H01L23/00 ,  H01L33/62 ,  H01L25/075 ,  B23K1/0016 ,  B23K1/0056 ,  B23K1/203 ,  B23K2101/36 ,  H01L21/563 ,  H01L21/67144 ,  H01L21/67259 ,  H01L21/6835 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2224/11505 ,  H01L2224/16238 ,  H01L2224/7511 ,  H01L2224/75251 ,  H01L2224/75315 ,  H01L2224/75318 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81091 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/95 ,  H01L2224/95136 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/95 ,  H01L25/0753 ,  H01L2924/12041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L33/0093 ,  H01L33/0095 ,  H01L33/30 ,  H01L33/56

Abstract: Embodiments relate to using flux or underfill as a trapping layer for temporarily attaching light emitting diodes (LEDs) to a substrate and heating to simultaneously bond multiple LEDs onto the substrate. The flux or underfill may be selectively coated at the ends of electrodes of the LEDs prior to placing the LEDs on the substrate. Due to adhesive properties of the flux or underfill, multiple LEDs can be placed on and attached to the substrate prior to performing the bonding process. Once LEDs are placed on the substrate, the flux or underfill facilitates formation of metallic contacts between electrodes of the LED and contacts of the substrate during the bonding process. By using the flux or underfill, the formation of metallic contacts can be performed even without applying pressure.