公开(公告)号：WO2004094314A3

公开(公告)日：2005-03-24

申请号：PCT/US2004008982

申请日：2004-03-24

Applicant: HARRIS CORP

Inventor： FISCHER CHARLES ROBERT ,  PEDERSEN ANDERS P ,  WHYBREW WALTER M

IPC: H01P1/04 ,  H01P3/08 ,  H01P5/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H01P5/02

CPC classification number: H01P1/047 ,  H01P3/081 ,  H01P3/085 ,  H01P5/184 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/115 ,  H05K3/4046 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/09536 ,  H05K2201/09809 ,  H05K2201/10287

Abstract: A concentric 'conductor within a via' RF interconnect architecture, has an inner via (63) through which at least one RF signal conductor passes. The inner conductive via is coaxially formed within and stably coaxially aligned within an outer conductive via (53), which serves as a coaxial ground plane that completely surrounds the inner conductive via. The outer conductive via passes through dielectric layers (61, 62) of microstrip or stripline structures (71, 72) on opposite sides of a multi printed circuit laminate (30).

Abstract translation: 通过RF互连架构内的同心导体具有至少一个RF信号导体通过的内通孔（63）。 内部导电通孔同轴地形成在外部导电通孔（53）内且稳定地同轴对准，外部导电通孔（53）用作完全包围内部导电通孔的同轴接地平面。 外导电通孔穿过多印刷电路层压板（30）的相对侧上的微带线或带状线结构（71,72）的介电层（61,62）。