PROCESS FOR FORMING AND COMPOSITE COMPRISING CONDUCTING PATHS COMPRISING SILVER
    1.
    发明申请
    PROCESS FOR FORMING AND COMPOSITE COMPRISING CONDUCTING PATHS COMPRISING SILVER 审中-公开
    用于形成和复合包含包含银的导电板的方法

    公开(公告)号:WO2015078671A2

    公开(公告)日:2015-06-04

    申请号:PCT/EP2014/073774

    申请日:2014-11-05

    Abstract: The invention relates generally to a process (100) comprising as process steps: a)providing a substrate having a substrate surface; b) providing a first composition, comprising: i) Sn Cl 2 , and ii) water; c)providing a second composition, comprising: i) sulfuric acid, and ii) a reducing agent; d) providing a third composition, obtainable by mixing: i) AgNO 3 , ii) nitric acid, iii) water, and iv) NH 3 ; e) contacting the substrate surface with the first composition under obtaining an activated substrate surface; f) contacting the activated substrate surface with the second composition and the third composition, wherein the activated substrate surface has a temperature in a range from about 10 to about 50°C. The invention further relates to a composite obtainable by the above process; to a composite comprising an Ag-comprising layer; to a composition comprising AgNO 3 ; and to a use of composition comprising AgNO 3 for forming conducting paths.

    Abstract translation: 本发明一般涉及一种方法(100),其包括以下步骤:a)提供具有基底表面的基底; b)提供第一组合物,其包含:i)SnCl 2,和ii)水; c)提供第二组合物,其包含:i)硫酸,和ii)还原剂; d)提供可通过混合获得的第三组合物:i)AgNO 3,ii)硝酸,iii)水,和iv)NH 3; e)在获得活化的基底表面的情况下使基底表面与第一组合物接触; f)使活化的基底表面与第二组合物和第三组合物接触,其中活化的基底表面的温度在约10至约50℃的范围内。 本发明还涉及通过上述方法获得的复合物; 涉及包含含Ag层的复合材料; 涉及包含AgNO 3的组合物; 以及使用包含AgNO 3的组合物来形成导电路径。

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