Abstract:
The present disclosure is drawn to an insulated sensor including a silicon substrate with active circuitry on a surface thereof, an electrode disposed on the silicon substrate, a passivation layer having a thickness from greater than 500 Angstroms to 3,000 Angstroms disposed on the active circuitry, and an electrode insulating layer having a thickness from 10 Angstroms to 500 Angstroms disposed on the electrode.
Abstract:
Example implementations relate to coagulation sensing. For example, a microfluidic chip for coagulation sensing may include a microfluidic channel, an outlet at an end of the microfluidic channel having an air interface, and an impedance sensor located within the microfluidic channel and within a particular proximity to the air interface, the impedance sensor to determine a stage of a coagulation cascade of a blood sample flowing through the microfluidic channel to the impedance sensor.
Abstract:
In an embodiment, a fluid ejection device includes a fluidic channel having first and second ends and a drop generator disposed within the channel. A fluid reservoir is in fluid communication with the first and second ends of the channel, and an alternating-current electro-osmotic (ACEO) pump is disposed within the channel to generate net fluid flow from the reservoir at the first end, through the channel, and back to the reservoir at the second end.
Abstract:
A microfluidic diagnostic chip may, in an example, include a number of microfluidic channels defined in a substrate each microfluidic channel fluidly coupled to at least one fluidic slot; the at least one fluidic slot to receive a number of fluids, and a number of gold sensors each gold sensor having a thickness of between 1500 and 5000 angstroms (Å).
Abstract:
A device includes a microfluidic channel structure on a substrate and a first resistive structure on the substrate to control the temperature of at least the substrate. The first resistive structure is separate from, and independent of the, microfluidic channel structure. In some instances, the device includes a second resistive structure.
Abstract:
A printhead die (200) for an inkjet-printing device includes a substrate (302), a heating resistor, and an edge protection layer (209) The heating resistor is formed on the substrate, and has one or more edges The heating resistor is operative to cause an ink droplet to be ejected from the inkjet-printing device upon sufficient current flowing through the heating resistor resulting in a bubble nucleating within ink at the heating resistor and thereafter collapsing at the heating resistor The edge protection layer covers just the edges of the heating resistor in order to at least substantially protect the heating resistor from becoming damaged due to collapsing of the bubble at the heating resistor
Abstract:
An electrode system and a method of using an electrode system to make an impedance measurement. The electrode system comprises a substrate that supports a first and second electrodes. The first electrode is located inside a cutout of the second electrode. The first and second electrodes are separated by an insulating layer.
Abstract:
A device including a substrate and a channel formed in a layer disposed on the substrate. The layer includes a cavitation layer and a passivation layer to mitigate the effects of hydrodynamic cavitation on a surface of the channel. The passivation and cavitation material and thickness are optimized thermally to nucleate and eject a bubble at low voltages. A resistive heating element is disposed within the channel that is activated to create a micro-fluidic pump to advance a fluid through the channel. A sensor is disposed within the channel to measure a characteristic of the fluid passing through the channel.
Abstract:
A system may comprise a voltage upconverter, a universal serial bus (USB) connector to receive an input voltage from a USB port on a computing device, and a microfluidic diagnostic chip communication link to electrically couple the voltage upconverter to a microfluidic diagnostic chip wherein the voltage upconverter is to convert the input voltage to be received by the USB connector to an output voltage sufficient to drive a pump on the microfluidic diagnostic chip. A diagnostic system may comprise a microfluidic diagnostic chip comprising a pump and a voltage upconverter to receive an input voltage from a universal serial bus (USB) port of a computing device and to convert the input voltage into an output voltage that powers activation of the pump.
Abstract:
In one embodiment, a fluid ejection device includes a substrate with a fluid slot and a membrane adhered to the substrate that spans the fluid slot. A resistor is disposed on top of the membrane over the fluid slot, and a fluid feed hole next to the resistor extends through the membrane to the slot. A shelf extends from the edge of the resistor to the edge of the feed hole, and a passivation layer covers the resistor and part the shelf. An etch-resistant layer is formed partly on the shelf and in between the fluid feed hole and the resistor.