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    LOGIC CIRCUITRY PACKAGE
    1.
    发明申请
    LOGIC CIRCUITRY PACKAGE 审中-公开

    公开(公告)号：WO2020117395A1

    公开(公告)日：2020-06-11

    申请号：PCT/US2019/058001

    申请日：2019-10-25

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： GARDNER, James Michael ,  LU, Sirena ,  LINN, Scott A.

    IPC: B41J2/175 ,  G06F21/44 ,  G06F21/60

    Abstract: A logic circuitry package for a replaceable print apparatus component includes a first at least one analog cell of a first type, a second at least one analog cell of a second type, an analog-digital converter (ADC), an interface to communicate with a print apparatus logic circuit, and at least one logic circuit. The at least one logic circuit is configured to receive, via the interface, requests to perform measurements to selected ones of the at least one first and second analog cells. The at least one logic circuit is configured to selectively route analog signals from the selected analog cells to the ADC based on the requests.

    SENSOR CIRCUITRY PACKAGE FOR REPLACEABLE PRINT APPARATUS COMPONENT
    5.
    发明申请
    SENSOR CIRCUITRY PACKAGE FOR REPLACEABLE PRINT APPARATUS COMPONENT 审中-公开

    公开(公告)号：WO2021080611A1

    公开(公告)日：2021-04-29

    申请号：PCT/US2019/058127

    申请日：2019-10-25

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： GARDNER, James Michael ,  DERRYBERRY, Frank D. ,  LU, Sirena

    IPC: B41J2/175 ,  G01F23/24 ,  B41J29/393

    Abstract: A liquid level sensor package for a replaceable print liquid reservoir, the package including a substrate, a surface layer to contact a print liquid in the print liquid reservoir, and a layer stack including a number of metal layers disposed between the substrate and the surface layer. An array of heater elements disposed in one of the metal layers of the layer stack, and an array of thermal sensors disposed in a different one of the metal layers of the layer stack, each thermal sensor corresponding to a different heater element of the array of heater elements, and each thermal sensor to provide indication of a presence or absence of print liquid based on a sensed temperature after being heated by the corresponding heater element.

    VOLTAGE UPCONVERTER
    6.
    发明申请
    VOLTAGE UPCONVERTER 审中-公开
    电压UPCONVERTER

    公开(公告)号：WO2016122614A1

    公开(公告)日：2016-08-04

    申请号：PCT/US2015/013832

    申请日：2015-01-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： GIRI, Manish ,  VALENCIA, Melinda M. ,  SMITH, Matthew David ,  LU, Sirena ,  YU, Joshua M. ,  BENGALI, Sadiq

    IPC: G05F1/56 ,  H02M3/155

    CPC classification number: B01L3/502715 ,  B01L2300/023 ,  B01L2400/0475 ,  H02J1/00 ,  H02J2001/008 ,  H02M3/155 ,  H02M3/156

    Abstract: A system may comprise a voltage upconverter, a universal serial bus (USB) connector to receive an input voltage from a USB port on a computing device, and a microfluidic diagnostic chip communication link to electrically couple the voltage upconverter to a microfluidic diagnostic chip wherein the voltage upconverter is to convert the input voltage to be received by the USB connector to an output voltage sufficient to drive a pump on the microfluidic diagnostic chip. A diagnostic system may comprise a microfluidic diagnostic chip comprising a pump and a voltage upconverter to receive an input voltage from a universal serial bus (USB) port of a computing device and to convert the input voltage into an output voltage that powers activation of the pump.

    Abstract translation: 系统可以包括电压上变频器，用于接收来自计算设备上的USB端口的输入电压的通用串行总线（USB）连接器以及将电压上变频器电耦合到微流体诊断芯片的微流体诊断芯片通信链路，其中， 电压上变频器是将要由USB连接器接收的输入电压转换为足以驱动微流体诊断芯片上的泵的输出电压。 诊断系统可以包括微流体诊断芯片，其包括泵和电压上变频器，以从计算设备的通用串行总线（USB）端口接收输入电压，并将输入电压转换成输出电压，以激励泵 。

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