公开(公告)号：WO2016187010A1

公开(公告)日：2016-11-24

申请号：PCT/US2016/032369

申请日：2016-05-13

Applicant: ILLINOIS TOOL WORKS INC.

Inventor： BLAIR, Paul M. ,  BAILEY, Elizabeth B.

IPC: B23K1/008 ,  B23K3/04 ,  B23K3/08 ,  C09D133/00 ,  F27B9/30 ,  F27B9/34 ,  F27D1/10 ,  F27D1/16

CPC classification number: B08B7/0014 ,  B08B9/027 ,  B23K1/008 ,  B23K3/04 ,  B23K3/08 ,  F27B9/24 ,  F27B9/3077 ,  F27D1/0003 ,  F27D1/1684 ,  F27D7/04 ,  F27D9/00 ,  F27D2009/0072 ,  H01L21/67109 ,  H01L21/67173 ,  H01L21/6776

Abstract: A liner (92) for contamination control in a reflow oven, which reflow oven has surfaces, includes a substrate (94) having a length and a width defining an area. The substrate (94) has a thickness defined by first and second sides. An adhesive is positioned on the first side of the substrate (94). The substrate (94) is removably adhered to the surfaces of the reflow oven, and the liner (92) is configured to accumulate solder reflow contaminants thereon or to repel solder flux vapors and/or fumes, and is configured for removal from the surfaces with any accumulated contaminants. A method of treating the surfaces of a reflow oven is also disclosed.

Abstract translation: 在回流炉中具有表面的用于污染控制的衬套（92）包括具有限定面积的长度和宽度的衬底（94）。 基板（94）具有由第一和第二侧限定的厚度。 粘合剂位于基底（94）的第一侧上。 衬底（94）可移除地粘附到回流炉的表面，并且衬套（92）被配置为在其上积聚焊料回流污染物或排斥焊剂蒸汽和/或烟雾，并且被配置为从表面去除 任何积累的污染物。 还公开了一种处理回流炉表面的方法。