公开(公告)号：WO2022271241A1

公开(公告)日：2022-12-29

申请号：PCT/US2022/021880

申请日：2022-03-25

Applicant: INTEL CORPORATION

Inventor： WAIDHAS, Bernd ,  HANNA, Carlton ,  MOREIN, Stephen ,  KESER, Lizbeth ,  SEIDEMANN, Georg

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/18 ,  H01L23/36 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/08225 ,  H01L2224/24137 ,  H01L23/3675 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/24 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19106 ,  H05K1/181

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate including a first conductive pathway electrically coupled to a power source; a mold material on the package substrate including a first microelectronic component embedded in the mold material, a second microelectronic component embedded in the mold material, and a TMV, between the first and second microelectronic components, the TMV electrically coupled to the first conductive pathway; a redistribution layer (RDL) on the mold material including a second conductive pathway electrically coupled to the TMV; and a third microelectronic component on the RDL and electrically coupled to the second conductive pathway, wherein the second conductive pathway electrically couples the TMV, the first microelectronic component, and the third microelectronic component.