公开(公告)号：WO2016144320A1

公开(公告)日：2016-09-15

申请号：PCT/US2015/019524

申请日：2015-03-09

申请人： INTEL CORPORATION

发明人： MARIN, Brandon, C. ,  GHOSH DASTIDAR, Trina ,  SENEVIRATNE, Dilan ,  LI, Yonggang ,  CHAVA, Sirisha

IPC分类号： H01L21/3205

CPC分类号： H01L23/14 ,  H01L21/4846 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49866 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K3/062 ,  H05K3/105 ,  H05K3/107 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0209 ,  H05K2203/107

摘要： Embodiments of the present disclosure describe selective metallization of an integrated circuit (IC) substrate. In one embodiment, an integrated circuit (IC) substrate may include a dielectric material and metal crystals having a polyhedral shape dispersed in the dielectric material and bonded with a ligand that is to ablate when exposed to laser light such that the metal crystals having the ablated ligand are activated to provide a catalyst for selective electroless deposition of a metal. Other embodiments may be described and/or claimed

摘要翻译： 本公开的实施例描述了集成电路（IC）衬底的选择性金属化。 在一个实施例中，集成电路（IC）衬底可以包括介电材料和具有分散在电介质材料中的多面体形状的金属晶体，并且与暴露于激光时要被烧蚀的配体结合，使得具有烧蚀的金属晶体 配体被激活以提供用于金属的选择性无电沉积的催化剂。 可以描述和/或要求保护其他实施例

公开(公告)号：WO2023048804A1

公开(公告)日：2023-03-30

申请号：PCT/US2022/037742

申请日：2022-07-20

申请人： INTEL CORPORATION

发明人： ECTON, Jeremy, D. ,  PIETAMBARAM, Srinivas, V. ,  MARIN, Brandon, C. ,  CHEN, Haobo ,  ARANA, Leonel

IPC分类号： H01L23/498 ,  H01L23/15 ,  H01L23/00 ,  H01L21/48 ,  H01L23/14

摘要： Embodiments include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a first substrate, and a second substrate coupled to the first substrate. In an embodiment, the second substrate comprises a core, and the core comprises an organic material. In an embodiment, a third substrate is coupled to the second substrate, and the third substrate comprises a glass layer.