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    TECHNIQUES FOR PROVIDING AN INTERFACE COMPONENT FOR A WEARABLE DEVICE
    2.
    发明申请
    TECHNIQUES FOR PROVIDING AN INTERFACE COMPONENT FOR A WEARABLE DEVICE 审中-公开
    用于为可穿戴设备提供接口部件的技术

    公开(公告)号：WO2017112333A1

    公开(公告)日：2017-06-29

    申请号：PCT/US2016/063760

    申请日：2016-11-25

    Applicant: INTEL CORPORATION

    Inventor： YONG, Khang Choong ,  CHEAH, Shu Young ,  SONG, Wil Choon ,  KONG, Jackson Chung Peng ,  HECK, Howard

    IPC: G06F1/16 ,  G06F3/045 ,  G06F3/01

    CPC classification number: G06F1/163 ,  A41D1/005 ,  G06F1/1656 ,  H01R4/58 ,  H01R12/7011 ,  H01R12/718 ,  H05K1/11 ,  H05K3/4007 ,  H05K2201/09027

    Abstract: Various embodiments are generally directed to an apparatus, method and other techniques to provide a interface component including a housing comprising a first shell portion and a second shell portion, the first shell portion forming an extended portion for the housing and comprising a retention track engageable a counterpart retention track. The interface component to include a printed circuit board disposed within the housing, the printed circuit board comprising a plurality of contact pins each comprising a contact hole and a retention bump and a socket to couple with a stud.

    Abstract translation: 各种实施例通常涉及提供界面部件的设备，方法和其他技术，所述界面部件包括包含第一外壳部分和第二外壳部分的外壳，第一外壳部分形成用于 并且包括可与对应的保持轨道接合的保持轨道。 所述接口部件包括设置在所述壳体内的印刷电路板，所述印刷电路板包括多个接触引脚，每个接触引脚包括接触孔和保持凸起以及用于与螺柱联接的插座。

    SLOT ANTENNA ON A PRINTED CIRCUIT BOARD (PCB)
    4.
    发明申请
    SLOT ANTENNA ON A PRINTED CIRCUIT BOARD (PCB) 审中-公开

    公开(公告)号：WO2018118321A1

    公开(公告)日：2018-06-28

    申请号：PCT/US2017/062759

    申请日：2017-11-21

    Applicant: INTEL CORPORATION

    Inventor： GOH, Eng Huat ,  LIM, Min Suet ,  KOH, Boon Ping ,  SONG, Wil Choon ,  YONG, Khang Choong

    IPC: H01Q13/10 ,  H01Q1/38

    Abstract: Embodiments herein disclose techniques for apparatuses and methods for making a slot antenna on a PCB with a cutout. A PCB may include a metal layer. The metal layer may include a cavity to be a first radiating element of an antenna, and a slot to be a second radiating element of the antenna. In addition, the cavity may extend to be the cutout of the PCB through other layers of the PCB. The first and second radiating elements may provide a determined transmission frequency for the antenna. The metal layer may further include a portion of a transmission line of the antenna, and the transmission line is in contact with the cavity and the slot. A package may be affixed to the PCB, where a portion of the package may be within the cutout of the PCB. Other embodiments may be described and/or claimed.

    MICROELECTRONIC DEVICE PACKAGE ELECTROMAGNETIC SHIELD
    5.
    发明申请
    MICROELECTRONIC DEVICE PACKAGE ELECTROMAGNETIC SHIELD 审中-公开
    微电子器件包装电磁屏蔽

    公开(公告)号：WO2018063655A1

    公开(公告)日：2018-04-05

    申请号：PCT/US2017/049012

    申请日：2017-08-29

    Applicant: INTEL CORPORATION

    Inventor： LIM, Min Suet ,  GOH, Eng Huat ,  YONG, Khang Choong ,  KOH, Boon Ping ,  SONG, Wil Choon

    IPC: H01L23/60 ,  H01L23/485 ,  H01L23/00 ,  H01L25/07

    CPC classification number: G06F1/182 ,  H01L23/552 ,  H01L24/16 ,  H01L24/33 ,  H01L2224/16237 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/15313 ,  H01L2924/3025

    Abstract: Microelectronic devices including an electromagnetic shield over a desired portion of a substrate. The magnetic shield is formed of conductive particles within a selectively curable layer, such as a solder resist material. After application to the substrate, the conductive particles are allowed to settle to form a conductive structure to serve as an electromagnetic shield. The electromagnetic shield can be formed primarily over regions of the substrate containing conductive traces coupled in the package to communicate signals presenting a risk of causing electromagnetic interference with other devices.

    Abstract translation: 包括在衬底的期望部分上的电磁屏蔽的微电子器件。 磁屏蔽由选择性可固化层内的导电颗粒形成，例如阻焊材料。 在施加到衬底之后，允许导电颗粒沉降以形成导电结构以用作电磁屏蔽。 电磁屏蔽可以主要形成在包含耦合在封装中的导电迹线的基板的区域上，以传递具有引起对其他设备的电磁干扰的风险的信号。

    BOARD TO BOARD INTERCONNECT
    6.
    发明申请
    BOARD TO BOARD INTERCONNECT 审中-公开
    董事会互连

    公开(公告)号：WO2017112083A1

    公开(公告)日：2017-06-29

    申请号：PCT/US2016/059252

    申请日：2016-10-28

    Applicant: INTEL CORPORATION

    Inventor： WONG, Chee Ling ,  SONG, Wil Choon ,  YONG, Khang Choong ,  GOH, Eng Huat ,  BIN ABDULLAH, Mohd Muhaiyiddin ,  CHUAH, Tin Poay

    IPC: H05K3/40 ,  H05K1/11

    CPC classification number: H05K1/117 ,  H05K1/0298 ,  H05K1/142 ,  H05K2201/09845

    Abstract: A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.

    Abstract translation: 这里描述了用于板对板互连的系统。 该系统包括第一印刷电路板（PCB），该第一印刷电路板具有沿着第一PCB的第一边缘的第一凹部，该第一凹部暴露第一PCB层上的第一焊料焊盘。 该系统还包括具有沿着第二PCB的第二边缘的第二凹部的第二PCB，其暴露第二PCB的层上的第二焊料焊盘。 第二凹槽与第一凹槽互补，以允许第一PCB与第二PCB配合。 当第一PCB与第二PCB配合时，第一焊盘与第二焊盘对齐。 该系统还包括一个组件，该组件被配置为将第一焊盘与第二焊盘电子耦合。

    GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE VIA HMI EXTENSION
    7.
    发明申请
    GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE VIA HMI EXTENSION 审中-公开
    陀螺传感系统，通过人机界面扩展来增强可佩戴的设备用户体验

    公开(公告)号：WO2016204902A1

    公开(公告)日：2016-12-22

    申请号：PCT/US2016/032626

    申请日：2016-05-16

    Applicant: INTEL CORPORATION ,  YONG, Khang Choong ,  SONG, Wil Choon ,  HECK, Howard L. ,  PHUN, Su Sin Florence

    Inventor： YONG, Khang Choong ,  SONG, Wil Choon ,  HECK, Howard L. ,  PHUN, Su Sin Florence

    IPC: G06F3/01

    CPC classification number: G06F3/0362 ,  G06F1/163

    Abstract: Methods and systems may provide for a gyratory sensing system (GSS) for extending the human machine interface (HMI) of an electronic device, particularly small form factor, wearable devices. The gyratory sensing system may include a gyratory sensor and a rotatable element to engage the gyratory sensor. The rotatable element may be sized and configured to be easily manipulated by hand to extend the HMI of the electronic device such that the functions of the HMI may be more accessible. The rotatable element may include one or more rotatable components, such as a body, edge or face of a smart watch, that each may be configured to perform a function upon rotation, such as resetting, selecting, and/or activating a menu item.

    Abstract translation: 方法和系统可以提供旋转感测系统（GSS），用于扩展电子设备的人机接口（HMI），特别是小型的可穿戴设备。 旋转感测系统可以包括旋转传感器和可旋转元件以接合旋转传感器。 可旋转元件的尺寸和构造可以用手轻松操作以延伸电子设备的HMI，使得HMI的功能可以更易于访问。 可旋转元件可以包括一个或多个可旋转部件，例如智能手表的主体，边缘或面，每个可以被配置为在旋转时执行功能，例如复位，选择和/或激活菜单项。

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