公开(公告)号：WO2022098342A1

公开(公告)日：2022-05-12

申请号：PCT/US2020/058622

申请日：2020-11-03

Applicant: INTEL CORPORATION

Inventor： THAKUR, Jayprakash ,  DEGANI, Ofir ,  KRONFELD, Ronen ,  RESHEF, Ehud ,  SUH, Seong-Youp, J. ,  SHOSHANA, Tal ,  MANN, Eytan ,  TAMRAKAR, Maruti ,  RAVI, Ashoke ,  CAMACHO PEREZ, Jose Rodrigo ,  HUUSARI, Timo Sakari ,  BOROKHOVICH, Eli ,  RUBIN, Amir ,  BENJAMIN, Ofer ,  YANG, Tae Young ,  SKINNER, Harry ,  LEE, Kwan Ho ,  LEE, Jaejin ,  HAN, Dong-Ho ,  GROSS, Shahar ,  SEGEV, Eran ,  KAMGAING, Telesphor

IPC: H04B1/50 ,  H04B1/00 ,  H04B1/44 ,  H01Q1/24

Abstract: In various aspects, a radio frequency circuit is provided. The radio frequency circuit may include a substrate that may include a radio frequency front-end to antenna (RF FE-to-Ant) connector. The RF FE-to-Ant connector may include a conductor track structure and a substrate connection structure coupled to the conductor track structure. The substrate may include radio frequency front-end circuitry monolithically integrated in the substrate. The substrate connection structure may include at least one of a solderable structure, a weldable structure, or an adherable structure. The substrate connection structure may be configured to form at least one radio frequency signal interface with an antenna circuit connection structure of a substrate-external antenna circuit. The substrate may include an edge region. The substrate connection structure may be disposed in the edge region.