公开(公告)号：WO1992009102A1

公开(公告)日：1992-05-29

申请号：PCT/US1991000703

申请日：1991-02-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： INTERNATIONAL BUSINESS MACHINES CORPORATION ,  CHANG, Kenneth ,  CZORNYJ, George ,  FAROOQ, Mukta, Shaji ,  KUMAR, Ananda, Hosakere ,  PITTLER, Marvin, S. +di ,  STEIMEL, Heinz, Otto

IPC: H01L21/48

CPC classification number: H01L21/76808 ,  H01L21/481 ,  H01L21/4857 ,  H01L21/76807 ,  H01L2221/1031 ,  H01L2221/1036 ,  H05K3/0023 ,  H05K3/0041 ,  H05K3/184 ,  H05K3/388 ,  H05K3/465 ,  H05K3/4661 ,  H05K3/467 ,  H05K2201/0154 ,  H05K2201/0376 ,  H05K2201/09563 ,  H05K2203/072 ,  H05K2203/107

Abstract: A method of making a multilayer thin film structure on the surface of a dielectric substrate which includes the steps of: a) forming a multilayer thin film structure including the steps of: applying a first layer of dielectric polymeric material on the surface of a dielectric substrate, applying a second layer of dielectric polymeric material over the first layer of polymeric material wherein the second polymeric material is photosensitive, imagewise exposing and developing the second polymeric material to form a feature therein, the second layer feature in communication with at least one feature formed in the first polymeric material; and b) filling the features in the entire multilayer structure simultaneously with conductive material. Preferably, the first layer feature is a via and the second layer feature is a capture pad or wiring channel. Also disclosed is a multilayer thin film structure made by this method.

Abstract translation: 一种在电介质基板的表面上制造多层薄膜结构的方法，包括以下步骤：a）形成多层薄膜结构，其包括以下步骤：将第一层电介质聚合物材料施加到介电基片的表面上 在所述第一聚合物材料层上施加第二层电介质聚合材料，其中所述第二聚合物材料是光敏的，成像曝光和显影所述第二聚合物材料以在其中形成特征，所述第二层特征与形成的至少一个特征相连通 在第一种聚合材料中; 以及b）与导电材料同时填充整个多层结构中的特征。 优选地，第一层特征是通孔，第二层特征是捕获垫或布线通道。 还公开了通过该方法制造的多层薄膜结构。