公开(公告)号：WO1991016725A1

公开(公告)日：1991-10-31

申请号：PCT/US1990005802

申请日：1990-10-10

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： INTERNATIONAL BUSINESS MACHINES CORPORATION ,  CHANG, Kenneth ,  CZORNYJ, George ,  KUMAR, Ananda, H. ,  STEIMEL, Heinz, O.

IPC: H01L21/48

CPC classification number: H01L21/4846 ,  H05K3/107 ,  H05K3/143 ,  H05K3/4644 ,  Y10S430/146

Abstract: The present invention provides a packaging semiconductor structure and method for obtaining same. The structure is comprised of at least one level of dielectric and metallurgy layers. The at least one level is comprised of a wiring metallurgy (18) plane and a 'through-via' plane of interconnecting metallurgy in association with both one and two layers of polymeric dielectric materials (13, 19). The self-alignment method of fabrication of the level provides a streamlined technique wherein stringent masking and alignment requirements are relaxed, undue processing such as at least one polishing step is eliminated and a structure having adhesive integrity is fabricated.