摘要:
A device having embedded metallic structures in a glass is provided. The device includes a first wafer, at least one conductive trace, a planarized insulation layer and a second wafer. The first wafer has at least one first wafer via that is filled with conductive material. The at least one conductive trace is formed on the first wafer. The at least one conductive trace is in contact with the at least one first wafer via that is filled with the conductive material. The planarized insulation layer is formed over the first wafer and at least one conductive trace. The planarized insulation layer further has at least one insulation layer via that provides a path to a portion of the at least one conductive trace. The second wafer is bonded to the planarized insulation layer.
摘要:
Some example forms relate to an electronic package. The electronic package includes a first dielectric layer that includes an electrical trace formed on a surface of the first dielectric layer and a second dielectric layer on the surface of the first dielectric layer. The second dielectric layer includes an opening. The electrical trace is within the opening. The electronic package includes an electrical interconnect that fills the opening and extends above an upper surface of the second dielectric layer such that the electrically interconnect is electrically connected to the electrical trace on the first dielectric layer.
摘要:
Die vorliegende Erfindung betrifft einen Schaltungsträger für eine elektronische Schaltung umfassend mindestens eine Leiterbahn (22); eine isolierende Matrix aus einem ersten Isolationsmaterial (17), mit dem die mindestens eine Leiterbahn (22) unter Aussparung zumindest eines ersten Bereiches (15) zum Anschließen mindestens eines elektronischen Bauteils(14) der elektronischen Schaltung umspritzt ist; sowie einen Kühlkörper (18); wobei die mindestens eine Leiterbahn (22) mit der ersten Isolationsmaterial (17) derart umspritzt ist, dass die isolierende Matrix (16) weiterhin mindestens einen zweiten Bereich (34) ausspart, der zwischen der Leiterbahn (22) und dem Kühlkörper (18) angeordnet ist, wobei der Schaltungsträger weiterhin eine Vielzahl von Distanzhaltern (28; 36) umfasst, die ausgelegt und angeordnet ist, um eine Höhe (h1) des zweiten Bereichs (34) zwischen der Leiterbahn (22) und dem Kühlkörper (18) einzustellen, wobei der Schaltungsträger weiterhin ein zweites Isolationsmaterial (24) umfasst, mit dem der zweite Bereich (34) ausgefüllt ist. Die Erfindung betrifft überdies ein Verfahren zum Herstellen eines derartigen Schaltungsträgers für eine elektronische Schaltung.
摘要:
A method and apparatus for the additive fabrication of single and multi-layer electronic circuits by using directed local deposition of conductive, insulating, and/or dielectric materials to build circuit layers incorporating conductive, insulating and/or dielectric features, including inter-layer vias and embedded electronic components. Different conductive, insulating, and/or dielectric materials can be deposited at different points in the circuit such that any section of the circuit may be tailored for specific electrical, thermal, or mechanical properties. This enables more geometric and spatial flexibility in electronic circuit implementation, which optimizes the use of space such that more compact circuits can be manufactured.
摘要:
Methods and apparatus for controlling an equivalent-series resistance (ESR) of a capacitor are provided. An exemplary apparatus includes a substrate having a land side, the capacitor mounted on the land side of the substrate and having both the ESR and terminals, a resistive pattern coupled to the terminals, and a plurality of vias coupled to the resistive pattern. The resistive pattern is configured to control the ESR. The resistive pattern can be formed of a resistive paste. The resistive pattern can be formed in a substantially semicircular shape having an arc ranging from substantially 45 degrees to substantially 135 degrees. The capacitor can be a surface mount device. The resistive pattern can be formed in a shape of a land-side capacitor mounting pad, a via, or both.
摘要:
[Problem] To provide a method for producing a laminate that enables the formation of a small-diameter via hole having excellent conduction reliability, and that has outstanding heat resistance (solder heat resistance, for example). [Solution] Provided is a laminate production method, characterized by comprising: a step for forming, upon a support, a curable resin composition layer comprising a curable resin composition so as to obtain a support-equipped curable resin composition layer; a step for laminating, to a substrate, the support-equipped curable resin composition on the curable resin composition layer formation side thereof so as to obtain a support-equipped pre-curing complex comprising the substrate and the support-equipped curable resin composition layer; a step for performing first heating on the complex and heat-curing the curable resin composition layer so as to achieve a cured resin layer and thus obtain a support-equipped cured complex comprising the substrate and the support-equipped cured resin layer; a step for opening a hole from the support side of the support-equipped cured complex, thereby forming a via hole in the cured resin layer; a step for separating the support from the support-equipped cured complex so as to obtain a cured complex comprising the substrate and the cured resin layer; a step for removing the resin residue from inside the via hole of the cured complex; a step for performing second heating on the cured complex; and a step for forming a conductor layer on the inner peripheral wall of the via hold of the cured complex and on the cured resin layer.