公开(公告)号：WO2007100933A2

公开(公告)日：2007-09-07

申请号：PCT/US2007/060503

申请日：2007-01-12

Applicant: KLA TENCOR TECHNOLOGIES CORPORATION ,  NASSER-GHODSI, Mehran ,  GOTKIS, Yehiel ,  LOPATIN, Sergey ,  PICKARD, Garrett ,  GARCIA, Rudy F. ,  YU, Ming Lun ,  KRZECZOWSKI, Kenneth ,  LENT, Matthew ,  HUANG, Chris ,  MACDONALD, Niles K. ,  BOROWICZ, Stanislaw Marek ,  CHUANG, Tzu-chin

Inventor： NASSER-GHODSI, Mehran ,  GOTKIS, Yehiel ,  LOPATIN, Sergey ,  PICKARD, Garrett ,  GARCIA, Rudy F. ,  YU, Ming Lun ,  KRZECZOWSKI, Kenneth ,  LENT, Matthew ,  HUANG, Chris ,  MACDONALD, Niles K. ,  BOROWICZ, Stanislaw Marek ,  CHUANG, Tzu-chin

IPC: C23F1/00 ,  A61N5/00 ,  G21G5/00

CPC classification number: G03F7/2043 ,  H01J2237/31732 ,  H01J2237/3174 ,  H01J2237/31744 ,  H01L21/02057 ,  H01L21/3065 ,  H01L21/31116 ,  H01L21/32136

Abstract: Etch selectivity enhancement during electron beam activated chemical etch (EBACE), methods and apparatus for evaluating the quality of structures on an integrated circuit wafer using EBACE, a method for modifying a surface of a substrate (or a portion there of), methods and apparatus for imaging a structure and an associated processor-readable medium are disclosed. A target or portion thereof may be exposed to a gas composition of a type that etches the target when the gas composition and/or target are exposed to an electron beam. By directing an electron beam toward the target in the vicinity of the gas composition, an interaction between the electron beam and the gas composition etches a portion of the target exposed to both the gas composition and the electron beam.

Abstract translation: 电子束激活化学蚀刻（EBACE）中的蚀刻选择性增强，用于使用EBACE评估集成电路晶片上的结构质量的方法和装置，用于改变衬底（或其部分）的表面的方法，方法和装置 用于对结构进行成像和相关联的处理器可读介质。 当气体组合物和/或靶暴露于电子束时，靶或其部分可暴露于蚀刻靶的类型的气体组合物。 通过在气体组合物附近引导电子束朝向靶，电子束和气体组成之间的相互作用会蚀刻暴露于气体组成和电子束两者的靶的一部分。

公开(公告)号：WO2003030206A1

公开(公告)日：2003-04-10

申请号：PCT/US2002/031517

申请日：2002-10-01

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION

Inventor： NASSER-GHODSI, Mehran ,  REICHERT, Jeffrey

IPC: H01J37/28

CPC classification number: H01J37/268 ,  G01N23/2252 ,  H01J2237/24592 ,  H01J2237/2817

Abstract: The present invention includes a system for localization of defects in test samples. A sample is scanned using a particle beam. Some particles interact with conductive elements and may cause the emission of x-rays. Other particles can pass through the sample entirely and generate a current that can be measured. A higher current generated indicates less conductive material at the scan target that may mean a void, dishing, or erosion is present. Localization of a defect can be confirmed using an x-ray emission detector.

Abstract translation: 本发明包括用于定位测试样品中的缺陷的系统。 使用粒子束扫描样品。 一些颗粒与导电元素相互作用，并可能导致x射线的发射。 其他颗粒可以完全通过样品，并产生可以测量的电流。 产生的较高的电流表示在扫描目标处的导电材料较少，这可能意味着存在空隙，凹陷或侵蚀。 可以使用x射线发射检测器确认缺陷的定位。

公开(公告)号：WO2003029799A1

公开(公告)日：2003-04-10

申请号：PCT/US2002/031518

申请日：2002-10-01

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION

Inventor： NASSER-GHODSI, Mehran ,  TESTONI, Anne ,  OESTREICH, Steve

IPC: G01N23/223

CPC classification number: G01N23/20

Abstract: The present invention provides a system for characterizing voids (411) in test samples. An X-ray emission inducer scans a target such as a via on a test sample. A metallization (409) or thin film layer (405) emits X-rays as a result of the scan. The X-ray emission intensity can be measured and compared against a control measurement. The information obtained can be used to characterize a void in the scan target.

Abstract translation: 本发明提供一种用于表征测试样品中的空隙（411）的系统。 X射线发射诱导器在测试样品上扫描诸如通孔的靶。 作为扫描的结果，金属化（409）或薄膜层（405）发射X射线。 可以测量X射线发射强度并与对照测量进行比较。 获得的信息可用于表征扫描目标中的空白。

公开(公告)号：WO2004021023A1

公开(公告)日：2004-03-11

申请号：PCT/US2003/020613

申请日：2003-06-25

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION

Inventor： NASSER-GHODSI, Mehran

IPC: G01R31/26

CPC classification number: H01J37/3056 ,  H01J37/304 ,  H01J2237/244 ,  H01J2237/30466

Abstract: Techniques for detecting endpoints during semiconductor dry-etching processes are described. The dry-etching process of the present invention involves using a combination of a reactive material and a charged particle beam, such as an electron beam. In another embodiment, a photon beam is used to facilitate the etching process. The endpoint detection techniques involve monitoring the emission levels of secondary electrons and backscatter electrons together with the current within the sample. Depending upon the weight given to each of these parameters, an endpoint is identified when the values of these parameters change more than a certain percentage, relative to an initial value for these values.

Abstract translation: 描述了在半导体干蚀刻工艺期间检测端点的技术。 本发明的干蚀刻方法包括使用反应性材料和带电粒子束（例如电子束）的组合。 在另一个实施例中，使用光子束来促进蚀刻工艺。 端点检测技术包括监测二次电子和反向散射电子的发射水平以及样品内的电流。 根据给予每个这些参数的重量，当这些参数的值相对于这些值的初始值改变多于一定百分比时，将识别端点。

公开(公告)号：WO2007035834A2

公开(公告)日：2007-03-29

申请号：PCT/US2006/036707

申请日：2006-09-20

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  BOROWICZ, S., Mark ,  NASSER-GHODSI, Mehran ,  KRZECZOWSKI, Kenneth, J.

Inventor： BOROWICZ, S., Mark ,  NASSER-GHODSI, Mehran ,  KRZECZOWSKI, Kenneth, J.

IPC: G01D1/00

CPC classification number: G05B19/41875 ,  G05B2219/31304 ,  G05B2219/37206 ,  G05B2219/37224 ,  G06Q50/04 ,  G06T7/0004 ,  G06T2207/30148 ,  Y02P90/10 ,  Y02P90/20 ,  Y02P90/22 ,  Y02P90/30

Abstract: Methods and systems for creating a recipe for a defect review process are provided. One method includes determining an identity of a specimen on which the defect review process will be performed. The method also includes identifying inspection results for the specimen based on the identity. In addition, the method includes creating the recipe for the defect review process based on the inspection results. One system includes a sensor configured to generate output responsive to an identity of a specimen on which the defect review process will be performed. The system also includes a processor configured to determine the identity of the specimen using the output, to identify inspection results for the specimen based on the identity, and to create the recipe for the defect review process based on the inspection results.

Abstract translation:

提供了用于创建缺陷审查过程的配方的方法和系统。 一种方法包括确定将在其上执行缺陷审查过程的样本的身份。 该方法还包括基于身份识别标本的检查结果。 另外，该方法包括基于检查结果创建缺陷审查过程的配方。 一个系统包括传感器，该传感器被配置为响应于将在其上执行缺陷审查过程的样本的身份产生输出。 该系统还包括处理器，该处理器被配置为使用输出来确定样本的身份，基于身份来识别样本的检查结果，并且基于检查结果来创建用于缺陷审查过程的配方。

公开(公告)号：WO2003065776A2

公开(公告)日：2003-08-07

申请号：PCT/US2003/002359

申请日：2003-01-23

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION

Inventor： NASSER-GHODSI, Mehran ,  WOOD, Phil

IPC: H05K

CPC classification number: G01N23/2252 ,  H01J2237/2445

Abstract: The present invention includes a system for efficient and effective detection and characterization of dishing and/or erosion. An x-ray emission inducer is used to scan a target on a sample. The target can be scanned at an acute incident angle to allow characterization of the dishing and/or erosion and analysis of the metallization or thin film layer topology.

Abstract translation: 本发明包括用于有效和有效地检测和表征凹陷和/或侵蚀的系统。 X射线发射诱导剂用于扫描样品上的靶。 可以以锐角入射角扫描靶，以便表征金属化或薄膜层拓扑的凹陷和/或腐蚀和分析。