公开(公告)号：WO2014001957A1

公开(公告)日：2014-01-03

申请号：PCT/IB2013/054972

申请日：2013-06-18

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： FLESKENS, Bas

IPC: H05K3/00

CPC classification number: H05K3/0061 ,  H05K7/20454 ,  H05K7/20509 ,  H05K2201/09063 ,  H05K2201/10401 ,  H05K2201/10598 ,  H05K2203/0195

Abstract: An assembly (15) for transferring and dissipating heat generated by electrical devices is disclosed. The assembly comprises a substrate (1) for holding electrical components, a heat transferring element (2) and a thermal interface material (3). The substrate (1) is coupled to the heat transferring element (2) by means of coupling members (4) which are integrally formed with the heat transferring element (2). The thermal interface material (3) is arranged between the substrate (1) and the heat transferring element (2) and in thermal contact with surfaces (7, 8) of the substrate (1) and the heat transferring element (2), respectively. Thereby, an assembly with a more stable thermal performance over its lifetime compared to known assemblies may be provided. A method for producing an assembly is also disclosed.

Abstract translation: 公开了一种用于传递和散发由电气设备产生的热的组件（15）。 组件包括用于保持电气部件的基板（1），传热元件（2）和热界面材料（3）。 基板（1）通过与传热元件（2）整体形成的联接构件（4）联接到传热元件（2）。 热界面材料（3）分别设置在基板（1）和传热元件（2）之间并分别与基板（1）和传热元件（2）的表面（7,8）热接触 。 因此，可以提供与已知组件相比在其寿命期间具有更稳定的热性能的组件。 还公开了一种用于制造组件的方法。

公开(公告)号：WO2013140295A3

公开(公告)日：2013-09-26

申请号：PCT/IB2013/051907

申请日：2013-03-11

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： FLESKENS, Bas ,  DEN BOER, Reinier Imre Anton

IPC: H01L23/42 ,  F21V29/00

Abstract: There is provided a thermal interface material, TIM, a thermal interface application comprising such a TIM, and corresponding methods for providing the material and the thermal interface. The TIM comprises a TIM layer in which an activable shrinkage material is distributed, such that upon activation of the shrinkage material the thickness of the TIM layer is increased. In the thermal interface application, where the TIM (400) is arranged between a heat generating component (20) and a heat conducting element (30), the increase in thickness of the TIM layer is utilized to increase the contact pressure on mating surfaces. The TIM is sandwiched between the heat generating component and the heat conducting element before the activation of the shrinkage material, and the distance (h) between the heat generating component and the heat conducting element is restricted such upon activation of the shrinkage material, the restricted maximum height (h) between the heat generating component and the heat conducting element in combination with the TIM increasing the thickness of the TIM layer, the contact pressure on the mating surfaces is increased.

公开(公告)号：WO2014115064A1

公开(公告)日：2014-07-31

申请号：PCT/IB2014/058310

申请日：2014-01-16

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： BANCKEN, Peter Henri ,  FLESKENS, Bas

IPC: F21K99/00 ,  F21V7/22 ,  B29C45/14 ,  F21V7/10 ,  H01L33/52 ,  H01L33/60 ,  F21V29/00

CPC classification number: F21K9/90 ,  B29C45/14639 ,  B29C45/14655 ,  B29C2045/14327 ,  B29L2011/00 ,  F21V7/10 ,  F21V7/22 ,  F21V19/0015 ,  F21V29/70 ,  F21V29/89 ,  F21Y2115/10 ,  Y10T29/49171

Abstract: A method for manufacturing a lighting assembly is disclosed, wherein a light emitting diode (LED) element (120) is arranged on a leadframe (110). The LED element (120) is configured to emit light when supplied with electrical power by means of the leadframe (110). At least a portion of the leadframe (110) is provided with an optically reflective and electrically insulating material (130) arranged to reflect light emitted from the LED element (120) and to electrically insulate at least a portion of the leadframe (110). A lighting assembly comprising the LED element (120) and the leadframe (110) is also disclosed.

Abstract translation: 公开了一种用于制造照明组件的方法，其中发光二极管（LED）元件（120）布置在引线框架（110）上。 LED元件（120）经配置以通过引线框架（110）供电时发光。 引线框架（110）的至少一部分设置有光学反射和电绝缘材料（130），其布置成反射从LED元件（120）发射的光并且电绝缘引线框架（110）的至少一部分。 还公开了包括LED元件（120）和引线框架（110）的照明组件。

公开(公告)号：WO2013186653A1

公开(公告)日：2013-12-19

申请号：PCT/IB2013/054406

申请日：2013-05-28

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： FLESKENS, Bas ,  VERBRUGH, Stefan Marcus ,  PEELS, Wilhelmus Gerardus Maria ,  BANCKEN, Peter Henri

IPC: H01L33/60 ,  H01L33/62 ,  H05K1/05

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/19107 ,  H01L2924/00014

Abstract: The present invention relates to a light emitting arrangement (1) comprising a lead frame (10). The lead frame comprises a reflective portion (30), a thermally conductive portion (60), a first electrically conductive portion (40; 43) and a second electrically conductive portion (41; 44). At least one light source (20) is arranged on said reflective portion of the lead frame. The at least one light source is electrically connected to the first electrically conductive portion and to the second electrically conductive portion, and thermally connected to the thermal portion. The first electrically conductive portion is electrically separated from the second electrically conductive portion. Preferably a circuit track (41) is connected to the light source or light sources and separated from the thermally conductive portion by an insulating layer (42).

Abstract translation: 本发明涉及包括引线框架（10）的发光装置（1）。 引线框架包括反射部分（30），导热部分（60），第一导电部分（40; 43）和第二导电部分（41; 44）。 至少一个光源（20）布置在引线框架的所述反射部分上。 所述至少一个光源电连接到第一导电部分和第二导电部分，并且热连接到热部分。 第一导电部分与第二导电部分电分离。 优选地，电路轨道（41）连接到光源或光源并且通过绝缘层（42）与导热部分分离。