公开(公告)号：WO2021072042A1

公开(公告)日：2021-04-15

申请号：PCT/US2020/054730

申请日：2020-10-08

Applicant: LAM RESEARCH CORPORATION

Inventor： WEIDMAN, Timothy William ,  NARDI, Katie Lynn ,  DICTUS, Dries ,  KAM, Benjamin ,  WU, Chenghao ,  HANSEN, Eric Calvin ,  KENANE, Nizan ,  GU, Kevin Li

IPC: G03F7/16 ,  G03F7/20 ,  G03F7/004 ,  G03F7/32 ,  C23C16/56

Abstract: The present disclosure relates to post-application treatment of a radiation-sensitive film to provide a hardened resist film. In some instances, such films can be used to form a pattern by a positive tone wet development process.