公开(公告)号：WO2022026323A1

公开(公告)日：2022-02-03

申请号：PCT/US2021/042978

申请日：2021-07-23

Applicant: LAM RESEARCH CORPORATION

Inventor： SIRARD, Stephen M. ,  BLACHUT, Gregory ,  LIMARY, Ratchana ,  HYMES, Diane ,  PAN, Yang

IPC: G03F7/004 ,  G03F7/105 ,  G03F7/20 ,  G03F7/26 ,  G03F7/36 ,  C08L65/00

Abstract: The present disclosure relates to a stimulus responsive polymer (SRP) that includes a homopolymer. Methods, films, and formulations employing an SRP are also described herein.

公开(公告)号：WO2022056160A1

公开(公告)日：2022-03-17

申请号：PCT/US2021/049713

申请日：2021-09-09

Applicant: LAM RESEARCH CORPORATION

Inventor： BANIK, Stephen J., II ,  BUCKALEW, Bryan L. ,  SIRARD, Stephen M. ,  BLACHUT, Gregory ,  LIMARY, Ratchana ,  HYMES, Diane ,  OBERST, Justin ,  SURESH, Priyanka

IPC: H01L23/00 ,  C08L65/00 ,  C08L71/00

Abstract: The present disclosure relates to use of a stimulus responsive polymer (SRP) as a capping material during direct metal-metal binding. Processes and layers employing an SRP are described herein.

公开(公告)号：WO2021046061A1

公开(公告)日：2021-03-11

申请号：PCT/US2020/048955

申请日：2020-09-01

Applicant: LAM RESEARCH CORPORATION ,  THE REGENTS OF THE UNIVERSITY OF CALIFORNIA

Inventor： BLACHUT, Gregory ,  HYMES, Diane ,  SIRARD, Stephen, M. ,  LIMARY, Ratchana ,  BATES, Christopher, M.

IPC: H01L21/56 ,  C08L65/00 ,  C08G61/02 ,  H01L23/00

Abstract: The present disclosure relates to methods of forming a film including small molecules. Such methods can optionally include removing such small molecules, such as by way of sublimation, evaporation, or conversion to a more volatile form.