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1.发明申请
公开(公告)号：WO2022026323A1
公开(公告)日：2022-02-03
申请号：PCT/US2021/042978
申请日：2021-07-23
Applicant: LAM RESEARCH CORPORATION
Inventor： SIRARD, Stephen M. , BLACHUT, Gregory , LIMARY, Ratchana , HYMES, Diane , PAN, Yang
Abstract: The present disclosure relates to a stimulus responsive polymer (SRP) that includes a homopolymer. Methods, films, and formulations employing an SRP are also described herein.
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公开(公告)号：WO2023049463A1
公开(公告)日：2023-03-30
申请号：PCT/US2022/044750
申请日：2022-09-26
Applicant: LAM RESEARCH CORPORATION
Inventor： SIRARD, Stephen M. , BLACHUT, Gregory , HYMES, Diane
Abstract: Methods of bracing high aspect ratio (HAR) structures include coating the HAR structures with stimulus responsive polymers (SRP) films followed by baking the SRP films at a temperature above the glass transition temperature (Tg) of the SRP film and below the degradation temperature of the SRP. In some embodiments, the SRP film includes a plasticizer.
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公开(公告)号：WO2021046572A1
公开(公告)日：2021-03-11
申请号：PCT/US2020/070483
申请日：2020-09-01
Applicant: LAM RESEARCH CORPORATION
Inventor： BLACHUT, Gregory , HYMES, Diane , SIRARD, Stephen M.
Abstract: Formulations for forming stimulus responsive polymers (SRPs) on semiconductor substrates include organic weak acids. Methods of protecting sensitive substrates including forming an SRP layer on sensitive substrates and forming one or more cap layers on the SRP layer.
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公开(公告)号：WO2022006349A1
公开(公告)日：2022-01-06
申请号：PCT/US2021/040009
申请日：2021-06-30
Applicant: LAM RESEARCH CORPORATION
Inventor： BLACHUT, Gregory , HYMES, Diane , SIRARD, Stephen M.
IPC: H01L21/02 , H01L21/3105 , H01L21/67 , H01L21/02118 , H01L21/02263 , H01L21/02277 , H01L21/31127
Abstract: A method includes performing a first substrate treatment on a substrate using a first dry process in a first substrate processing tool operating at vacuum; after the first substrate treatment, depositing a polymer film on an exposed surface of the substrate using a chemical vapor deposition (CVD) process in the first substrate processing tool; removing the substrate from the first substrate processing tool for a queue period; after the queue period, removing the polymer film from the substrate; and performing a second substrate treatment on the substrate using a second dry process in a second substrate processing tool.
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Patent Agency Ranking
公开(公告)号：WO2021231306A1
公开(公告)日：2021-11-18
申请号：PCT/US2021/031594
申请日：2021-05-10
Applicant: LAM RESEARCH CORPORATION
Inventor： SIRARD, Stephen M. , BLACHUT, Gregory , HYMES, Diane
IPC: H01L21/311 , H01L21/02 , H01J37/32 , C08L61/02
Abstract: Removing stimulus responsive polymers (SRPs) includes exposure to high energy metastable species, generated in a noble gas plasma, at an elevated temperature. The metastable species have sufficient energies and lifetimes to scission bonds on the polymer or other residues. At temperatures greater than the ceiling temperature of the SRP, there is a strong thermodynamic driving force to revert to volatile monomers once bond scissioning has occurred. The metastable species are not chemically reactive and do not appreciably affect the underlying surface. The high energy metastable species are effective at removing residues that remain after exposure to other stimuli such as heat.
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6.发明申请
公开(公告)号：WO2022056160A1
公开(公告)日：2022-03-17
申请号：PCT/US2021/049713
申请日：2021-09-09
Applicant: LAM RESEARCH CORPORATION
Inventor： BANIK, Stephen J., II , BUCKALEW, Bryan L. , SIRARD, Stephen M. , BLACHUT, Gregory , LIMARY, Ratchana , HYMES, Diane , OBERST, Justin , SURESH, Priyanka
Abstract: The present disclosure relates to use of a stimulus responsive polymer (SRP) as a capping material during direct metal-metal binding. Processes and layers employing an SRP are described herein.
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公开(公告)号：WO2021231307A1
公开(公告)日：2021-11-18
申请号：PCT/US2021/031595
申请日：2021-05-10
Applicant: LAM RESEARCH CORPORATION
Inventor： SIRARD, Stephen M. , BLACHUT, Gregory , HYMES, Diane
IPC: H01L21/311 , H01L21/02 , C08L61/02
Abstract: Removing a stimuli responsive polymer (SRP) from a substrate includes controlled degradation. In certain embodiments of the methods described herein, removing SRPs includes exposure to two reactants that react to form an acid or base that can trigger the degradation of the SRP. The exposure occurs sequentially to provide more precise top down control. In some embodiments, the methods involve diffusing a compound, or a reactant that reacts to form a compound, only to a top portion of the SRP. The top portion is then degraded and removed, leaving the remaining SRP intact. The exposure and removal cycles are repeated.
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8.发明申请
公开(公告)号：WO2021046061A1
公开(公告)日：2021-03-11
申请号：PCT/US2020/048955
申请日：2020-09-01
Inventor： BLACHUT, Gregory , HYMES, Diane , SIRARD, Stephen, M. , LIMARY, Ratchana , BATES, Christopher, M.
Abstract: The present disclosure relates to methods of forming a film including small molecules. Such methods can optionally include removing such small molecules, such as by way of sublimation, evaporation, or conversion to a more volatile form.
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公开(公告)号：WO2012166727A2
公开(公告)日：2012-12-06
申请号：PCT/US2012/039855
申请日：2012-05-29
Applicant: LAM RESEARCH CORPORATION , SIRARD, Stephen M. , HYMES, Diane , SCHOEPP, Alan M.
Inventor： SIRARD, Stephen M. , HYMES, Diane , SCHOEPP, Alan M.
IPC: H01L21/302
CPC classification number: H01L21/02057 , H01L21/67034 , H01L21/67109 , H01L21/67115 , H01L21/67248 , H01L21/6831
Abstract: An apparatus for freeze drying a substrate is provided. A chamber for receiving a substrate is provided. An electrostatic chuck (ESC) for supporting and electrostatically clamping the substrate is within the chamber. A temperature controller controls the temperature of the electrostatic chuck. A condenser is connected to the chamber. A vacuum pump is in fluid connection with the chamber.
Abstract translation: 提供一种用于冷冻干燥基材的装置。 提供了用于接收基板的室。 用于支撑和静电夹持衬底的静电吸盘（ESC）在腔室内。 温度控制器控制静电卡盘的温度。 冷凝器连接到腔室。 真空泵与腔室流体连接。
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