公开(公告)号：WO2019164761A1

公开(公告)日：2019-08-29

申请号：PCT/US2019/018190

申请日：2019-02-15

Applicant: LAM RESEARCH CORPORATION

Inventor： WANG, Feng ,  GAFF, Keith ,  KIMBALL, Christopher

IPC: H01L21/683 ,  H01L21/687 ,  H02N13/00 ,  B23Q3/15

Abstract: An electrostatic chuck for a substrate processing system is provided. The electrostatic chuck includes: a top plate configured to electrostatically clamp to a substrate and formed of ceramic; an intermediate layer disposed below the top plate; and a baseplate disposed below the intermediate layer and formed of ceramic. The intermediate layer bonds the top plate to the baseplate.

公开(公告)号：WO2020167451A1

公开(公告)日：2020-08-20

申请号：PCT/US2020/015148

申请日：2020-01-27

Applicant: LAM RESEARCH CORPORATION

Inventor： WANG, Feng ,  GAFF, Keith ,  KIMBALL, Christopher ,  EHRLICH, Darrell

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687 ,  H02N13/00 ,  B23Q3/15

Abstract: An electrostatic chuck for a substrate processing system includes a monolithic body made of ceramic. A plurality of first electrodes are arranged in the monolithic body adjacent to a top surface of the monolithic body and that are configured to selectively receive a chucking signal. A gas channel is formed in the monolithic body and is configured to supply back side gas to the top surface. Coolant channels are formed in the monolithic body and are configured to receive fluid to control a temperature of the monolithic body.

公开(公告)号：WO2018085054A3

公开(公告)日：2018-05-11

申请号：PCT/US2017/057450

申请日：2017-10-19

Applicant: LAM RESEARCH CORPORATION

Inventor： KIMBALL, Christopher ,  GAFF, Keith ,  WANG, Feng

IPC: H01L21/687 ,  H01L21/683 ,  H01L21/67 ,  H01L21/3065 ,  H01L21/02

Abstract: An edge ring is provided for use with an electrostatic wafer chuck and an electrostatic ring chuck with a central aperture with a cooling groove and with ring clamping electrodes and at least one ring backside temperature channel to regulate the temperature of the edge ring. The edge ring comprises an edge ring body to be placed over the electrostatic ring chuck with ring clamping electrodes, wherein the edge ring body comprises conductive portions which are placed over the ring clamping electrodes, when the edge ring body is placed over the electrostatic ring chuck and a first elastomer ring integrated to a first surface of the edge ring body and surrounding a central aperture of the first surface, wherein when the edge ring body is placed over the electrostatic ring chuck, the first elastomer ring is used to seal the cooling groove.

公开(公告)号：WO2018085054A2

公开(公告)日：2018-05-11

申请号：PCT/US2017/057450

申请日：2017-10-19

Applicant: LAM RESEARCH CORPORATION

Inventor： KIMBALL, Christopher ,  GAFF, Keith ,  WANG, Feng

IPC: H01L21/687 ,  H01L21/683 ,  H01L21/67 ,  H01L21/3065 ,  H01L21/02

Abstract: An edge ring is provided for use with an electrostatic wafer chuck and an electrostatic ring chuck with a central aperture with a cooling groove and with ring clamping electrodes and at least one ring backside temperature channel to regulate the temperature of the edge ring. The edge ring comprises an edge ring body to be placed over the electrostatic ring chuck with ring clamping electrodes, wherein the edge ring body comprises conductive portions which are placed over the ring clamping electrodes, when the edge ring body is placed over the electrostatic ring chuck and a first elastomer ring integrated to a first surface of the edge ring body and surrounding a central aperture of the first surface, wherein when the edge ring body is placed over the electrostatic ring chuck, the first elastomer ring is used to seal the cooling groove.

Abstract translation: 设置边缘环用于静电晶片卡盘和静电环卡盘，静电环卡盘具有带冷却槽的中心孔和环形夹持电极以及至少一个环形背面温度通道以调节温度 的边缘环。 边缘环包括利用环形夹持电极放置在静电环形卡盘上的边缘环体，其中边缘环体包括放置在环形夹持电极上的导电部分，当边缘环体放置在静电环形卡盘上时 以及第一弹性体环，其集成到所述边缘环本体的第一表面并围绕所述第一表面的中心孔，其中当所述边缘环本体放置在所述静电环形卡盘上时，所述第一弹性环用于密封所述冷却凹槽

公开(公告)号：WO2020041091A1

公开(公告)日：2020-02-27

申请号：PCT/US2019/046678

申请日：2019-08-15

Applicant: LAM RESEARCH CORPORATION

Inventor： WANG, Feng ,  PAPE, Eric A.

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/67

Abstract: A substrate support includes: a first plate configured to support a substrate; and a second plate that is connected to the first plate. The second plate includes at least one of: an internal coolant channel configured to receive coolant; and an internal gas channel configured to receive gas. The at least one of the internal coolant channel and the internal gas channel includes one of: chamfered internal corners; and staired internal corners.

公开(公告)号：WO2021168027A1

公开(公告)日：2021-08-26

申请号：PCT/US2021/018445

申请日：2021-02-18

Applicant: LAM RESEARCH CORPORATION

Inventor： WANG, Feng ,  MATYUSHKIN, Alexander ,  EHRLICH, Darrell ,  SAMULON, Eric

IPC: H01J37/32

Abstract: A baseplate for a substrate support in a substrate processing system includes at least one coolant channel formed within the baseplate. The at least one coolant channel defines a volume within the baseplate configured to retain a coolant and follows a path configured to distribute the coolant in the volume throughout the baseplate. At least one fin is provided within the at least one coolant channel. The at least one fin extends from at least one of a top, a bottom, and a sidewall of the at least one coolant channel into the volume to increase a surface area of the at least one coolant channel.