公开(公告)号：WO2021026110A1

公开(公告)日：2021-02-11

申请号：PCT/US2020/044816

申请日：2020-08-04

Applicant: LAM RESEARCH CORPORATION

Inventor： KIMBALL, Christopher ,  MOPIDEVI, Hema Swaroop ,  SRIRAMAN, Saravanapriyan ,  KAMP, Tom A. ,  EHRLICH, Darrell ,  CONTRERAS, Anthony ,  MACPHERSON, Chiara Helena Catherina Giammanco

IPC: H01L21/687 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H02N13/00

Abstract: A moveable edge ring system for a plasma processing system includes a top edge ring and a first edge ring arranged below the top edge ring. A second edge ring is made of conductive material and includes an upper portion, a middle portion and a lower portion. The top edge ring and the second edge ring are configured to move in a vertical direction relative to a substrate support and the first edge ring when biased upwardly by a lift pin. The second edge ring is arranged below the top edge ring and radially outside of the first edge ring.

公开(公告)号：WO2022035629A1

公开(公告)日：2022-02-17

申请号：PCT/US2021/044122

申请日：2021-08-02

Applicant: LAM RESEARCH CORPORATION

Inventor： SINGH, Harmeet ,  MITROVIC, Slobodan ,  EHRLICH, Darrell ,  WU, Benny

IPC: H01L21/67 ,  H01L21/683 ,  H05B3/14 ,  H05B3/28 ,  C23C16/458 ,  H01J37/32

Abstract: A substrate support assembly for supporting a substrate includes a baseplate, a ceramic plate arranged on the baseplate, and N resistive heaters arranged in X rows and Y columns and coupled to the ceramic plate. X, Y, and N are integers greater than 1, and N is less than or equal to X*Y. Each of the N resistive heaters have a first terminal and a second terminal. The ceramic plate includes Y conductors arranged in a first layer of the ceramic plate, and X conductors arranged in a second layer of the ceramic plate. The first terminals of each resistive heater in one of the X rows are directly connected to the Y conductors, respectively, by first vias. Second terminals of each resistive heater in the one of the X rows are directly connected to one of the X conductors by second vias.

公开(公告)号：WO2019118211A1

公开(公告)日：2019-06-20

申请号：PCT/US2018/063373

申请日：2018-11-30

Applicant: LAM RESEARCH CORPORATION

Inventor： BRUNNETT, Justin ,  TOKAIRIN, Shawn ,  LI, Shijian ,  EHRLICH, Darrell

IPC: G01K1/08 ,  G01K1/16 ,  G01K1/14

Abstract: A temperature sensor probe having a shaft is described. The shaft is made from a material that is corrosion resistant to plasma and remnants of a plasma process. The shaft extends over a portion of a metal layer, which forms a tip of the temperature sensor probe. The shaft further extends over a sleeve of the temperature sensor probe, a portion of a fiber optic medium of the temperature sensor probe and a portion of the fiber bundle housing of the temperature sensor probe. The material of the shaft increases a number of active processing hours for which the shaft is used within a plasma chamber during the plasma process.

公开(公告)号：WO2022046643A1

公开(公告)日：2022-03-03

申请号：PCT/US2021/047164

申请日：2021-08-23

Applicant: LAM RESEARCH CORPORATION

Inventor： DAS, Debanjan ,  SAMULON, Eric ,  EHRLICH, Darrell

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/67 ,  H01J37/32

Abstract: A component of a semiconductor processing chamber formed of a metal matrix component having an anodized layer on a surface thereof. The anodized layer comprises an aluminum oxide layer and is formed over an AlSic component. The anodized layer provides the component with protection against corrosion due to plasma processing gases, as the anodized layer provides a protective coating. A layer of aluminum is plated over a surface of the component and the aluminum layer is subsequently anodized to form the protective layer.

公开(公告)号：WO2020036613A1

公开(公告)日：2020-02-20

申请号：PCT/US2018/050273

申请日：2018-09-10

Applicant: LAM RESEARCH CORPORATION

Inventor： SANCHEZ, Alejandro ,  FORD, Grayson ,  EHRLICH, Darrell ,  ALWAN, Aravind ,  LEUNG, Kevin ,  CONTRERAS, Anthony ,  HAN, Zhumin ,  CASAES, Raphael ,  WU, Joanna

IPC: H01L21/687 ,  H01L21/68

Abstract: A first edge ring for a substrate support is provided. The first edge ring includes an annular-shaped body and one or more lift pin receiving elements. The annular-shaped body is sized and shaped to surround an upper portion of the substrate support. The annular-shaped body defines an upper surface, a lower surface, a radially inner surface, and a radially outer surface. The one or more lift pin receiving elements are disposed along the lower surface of the annular-shaped body and sized and shaped to receive and provide kinematic coupling with top ends respectively of three or more lift pins.

公开(公告)号：WO2021146098A1

公开(公告)日：2021-07-22

申请号：PCT/US2021/012593

申请日：2021-01-08

Applicant: LAM RESEARCH CORPORATION

Inventor： SAMULON, Eric ,  EHRLICH, Darrell

IPC: H01L21/687 ,  H02N13/00 ,  H01L21/683 ,  C23C16/458

Abstract: A baseplate of a substrate support assembly for supporting a semiconductor substrate in a processing chamber comprises a first component made of a first material including a metal and a nonmetal. The first material has a first coefficient of thermal expansion. A layer coating the first component is made of a second material. The second material has a second coefficient of thermal expansion. The first and second coefficients of thermal expansion are different.

公开(公告)号：WO2020252020A1

公开(公告)日：2020-12-17

申请号：PCT/US2020/036995

申请日：2020-06-10

Applicant: LAM RESEARCH CORPORATION

Inventor： HEINE, Benjamin Philip ,  EHRLICH, Darrell ,  KOSHY, Robin ,  MITROVIC, Slobodan ,  DAUGHERTY, John

IPC: H01J37/32

Abstract: A component for use in a plasma processing chamber is provided. A metal containing component body is provided. A sealant coating is over a surface of the metal containing component body, wherein the sealant coating comprises at least one of a silicone sealant, an organic sealant, or epoxy sealant, wherein the sealant coating is not covered and directly exposed to plasma in the plasma processing chamber.

公开(公告)号：WO2020167451A1

公开(公告)日：2020-08-20

申请号：PCT/US2020/015148

申请日：2020-01-27

Applicant: LAM RESEARCH CORPORATION

Inventor： WANG, Feng ,  GAFF, Keith ,  KIMBALL, Christopher ,  EHRLICH, Darrell

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687 ,  H02N13/00 ,  B23Q3/15

Abstract: An electrostatic chuck for a substrate processing system includes a monolithic body made of ceramic. A plurality of first electrodes are arranged in the monolithic body adjacent to a top surface of the monolithic body and that are configured to selectively receive a chucking signal. A gas channel is formed in the monolithic body and is configured to supply back side gas to the top surface. Coolant channels are formed in the monolithic body and are configured to receive fluid to control a temperature of the monolithic body.

公开(公告)号：WO2013078098A1

公开(公告)日：2013-05-30

申请号：PCT/US2012/065684

申请日：2012-11-16

Applicant: LAM RESEARCH CORPORATION ,  BISE, Ryan ,  DHINDSA, Rajinder ,  MARAKHTANOV, Alexei ,  LI, Lumin ,  NAM, Sang, Ki ,  ROGERS, Jim ,  HUDSON, Eric ,  DELGADINO, Gerardo ,  BAILEY, Andrew, D., III ,  KELLOGG, Mike ,  DE LA LIERA, Anthony ,  EHRLICH, Darrell

Inventor： BISE, Ryan ,  DHINDSA, Rajinder ,  MARAKHTANOV, Alexei ,  LI, Lumin ,  NAM, Sang, Ki ,  ROGERS, Jim ,  HUDSON, Eric ,  DELGADINO, Gerardo ,  BAILEY, Andrew, D., III ,  KELLOGG, Mike ,  DE LA LIERA, Anthony ,  EHRLICH, Darrell

IPC: C23F1/08

CPC classification number: H01J37/32449 ,  H01J37/32495 ,  H01J37/32541

Abstract: A system and method of plasma processing includes a plasma processing system including a plasma chamber and a controller coupled to the plasma chamber. The plasma chamber including a substrate support and an upper electrode opposite the substrate support, the upper electrode having a plurality of concentric gas injection zones.

Abstract translation: 等离子体处理的系统和方法包括等离子体处理系统，其包括等离子体室和耦合到等离子体室的控制器。 等离子体室包括基板支撑件和与基板支撑件相对的上电极，上电极具有多个同心气体注入区域。

公开(公告)号：WO2022076227A1

公开(公告)日：2022-04-14

申请号：PCT/US2021/052732

申请日：2021-09-29

Applicant: LAM RESEARCH CORPORATION

Inventor： KIMBALL, Christopher ,  EHRLICH, Darrell ,  OHKURA, Yuma

IPC: H01L21/687 ,  H01L21/683 ,  H01L21/67 ,  H01J37/32

Abstract: A moveable edge ring system for a substrate processing system includes a top moveable ring including a first annular body arranged around a substrate support. The top moveable ring is exposed to plasma during substrate processing. A moveable support ring is arranged below the top moveable ring and radially outside of a baseplate of the substrate support and includes a second annular body. A shield ring is arranged radially outside of the moveable support ring and includes a third annular body. A cover ring includes a fourth annular body arranged above a radially outer edge of the top moveable ring. An actuator and a lift pin are configured to adjust a position of the top moveable ring and the moveable support ring relative to the shield ring and the cover ring.