Abstract:
In an apparatus for removing material from an article, such as an exposed surface of an intermediate integrated circuit structure, by planarizing, polishing, etching or the like, a sensor is mechanically coupled to a moving carrier of the article for directing through the article to its first side an electromagnetic radiation beam having a wavelength band to which the structure is substantially transparent. The beam is detected after interacting with the article, such as being reflected from its exposed surface, and resulting information of the state of the processing of the exposed surface is transmitted from the moving carrier to a stationary receiver by radiation without the use of any physical transmission media such as wires or optical fibers. Multiple sensors mounted on the moving article carrier provide information of the uniformity of the processing across the exposed article surface. The radiation signal received by the stationary receiver is used to monitor or control the processing, such as by determining an endpoint thereof.
Abstract:
An automatic gain control technique integrates samples of an incoming analog signal a controlled amount of time so that the magnitudes of the samples lie within the desired input window of an analog-to-digital converter or other signal processing device. The values of the samples are then determined from a combination of the output of the signal processing device and their integration time. This is utilized in a system for determining the temperature of a surface of an object, without contacting the surface, by measuring the level of its infra-red radiation emission. A particular application of the system is to measure the temperature of a semiconductor wafer within a processing chamber while forming integrated circuits on it. The measuring system is configured on a single printed circuit board with an extra height metal heat sink structure to which a cooling unit is mounted. A photodetector and a circuit chip which performs the signal integrations are mounted within the cooling unit and operated at a uniform temperature. The combination of the variable time integration and cooling techniques greatly increases the signal-to-noise ratio of the measuring system. This allows surface temperature measurements to be made down to about 250 DEG C by measuring object emissions at slightly less than one micron in wavelength, conditions which provide signal levels which are normally too weak to measure accurately.
Abstract:
A luminescence-based integrated optical (11) and electronic system (29, 37, 51, 55, 59) for measuring temperature or some other parameter from the decay time of a luminescent sensor (25) is disclosed. A high bandwidth, low noise amplifier (31) applies a detected decaying luminescent signal to a digital system (29, 37, 51) that acquires that signal and processes it in order to determine its decay time characteristics that are related to temperature or another parameter being measured. The digital signal processing includes use of a digital curve-fitting technique. A preferred luminescent material for temperature measurement is a chromium-doped yttrium gallium garnet material. The entire optical and electronic portions of the measuring system can be accommodated on a small single circuit card (131).