Abstract:
High temperature range black body techniques are combined with lower temperature range photoluminescent techniques to provide an optical method and apparatus for measuring temperature over a very wide range. Various optical probe configurations are disclosed which combine the black body and photoluminescent technologies. Signal detection and processing can be combined, and temperature measurements made by the photoluminescent technique within an overlap of the two temperature ranges can be used to calibrate measurements made in the higher range by the black body technique.
Abstract:
An optical temperature measurement technique that utilizes the decaying luminescent intensity characteristic of a sensor composed of a luminescent material that is excited to luminescence by a light pulse or other periodic or other intermittent source of radiation. The luminescent emissions of a preferred sensor exhibit an approximately exponential decay with time that is the average of a distribution of chemically reproducible crystallites and are repeatable with a high degree of accuracy regardless of excitation level or prior temperature history of the sensor.
Abstract:
A predetermined stage of a changing condition is detected by monitoring a change in a signal relating to the changing condition. For example, the existence of a breakthrough that results from photoresist development, material etching, and the like, is detected by optically monitoring a semiconductor wafer, printed circuit board, and the like, that is being processed. An optimum end of the processing can then be determined in response to a breakthrough being detected, either for the purpose of monitoring the process or in order to automatically terminate the processing at that determined time. As part of the processing that determines the existence of a breakthrough, the optical signal is digitized and individual slope values calculated from groups of consecutive digital signal values.
Abstract:
Thermal, optical, physical and chemical characteristics of a substrate (11) surface are determined with non-contact optical techniques that include illuminating (23) the surface with radiation having a ripple intensity characteristic (51), and then measuring the combined intensities (53) of that radiation after modification by the substrate surface and radiation emitted from the surface. Precise determinations of emissivity, reflectivity, temperature, changing surface composition, the existence of any layer formed on the surface and its thickness are all possible from this measurement. They may be made in situ and substantially in real time, thus allowing the measurement to control (39, 41) various processes of treating a substrate surface. This has significant applicability to semiconductor wafer processing and metal processing.
Abstract:
An instrument that measures reflectivity, temperature and roughness of a substrate in a processing chamber remotely, without interfering with the process. The roughness of the substrate is estimated on the basis of depolarization measurements. The instrument automatically corrects for emissivity changes.
Abstract:
In an apparatus for removing material from an article, such as an exposed surface of an intermediate integrated circuit structure, by planarizing, polishing, etching or the like, a sensor is mechanically coupled to a moving carrier of the article for directing through the article to its first side an electromagnetic radiation beam having a wavelength band to which the structure is substantially transparent. The beam is detected after interacting with the article, such as being reflected from its exposed surface, and resulting information of the state of the processing of the exposed surface is transmitted from the moving carrier to a stationary receiver by radiation without the use of any physical transmission media such as wires or optical fibers. Multiple sensors mounted on the moving article carrier provide information of the uniformity of the processing across the exposed article surface. The radiation signal received by the stationary receiver is used to monitor or control the processing, such as by determining an endpoint thereof.
Abstract:
A connector (20) for connecting two groups of optical fibers (52) in axial alignment comprises a receptacle (22) having therein a bore (34) extending through it for holding therein two plugs (24), one on each side. The surface of the bore (34) has two flat portions (44), one at each end. The portions of the plugs (24) to be inserted into the bore (34) also have flat portions (42) shaped to contact the flat portions (44) of the bore surface. The shape of the bore (34) and of the plugs (24) are such that after the plugs are inserted into the bore with the complementary flat portions in contact, rotation of the plugs (24) relative to the receptacle (22) is thereby prevented or reduced and so the two plugs (24) are substantially fixed in position relative to each other. Each of the two groups of optical fibers (52) is connected to and fixed in position relative to the flat portions (42) of the two plugs (24), so that after the two plugs (24) are inserted into the bore (34), the two groups of optical fibers (52) are axially aligned. Each plug (24) includes a ferrule having therein a passage and whose cross-section is star-shaped or in the shape of a polygon. The plug (24) also includes an insert (26) shaped to fit into the passage with spaces between the insert and the passage surface. The optical fibers (52) in a group are inserted into the spaces between the insert (26) and the star-shaped or polygon-shaped surface of the passage in the ferrule for connecting the fibers (52) to the plug (24) and for fixing the positions of the optical fibers (52) relative to the flat portion (42) of the plug (24). The spaces between the insert (26) and the ferrule of each plug (24) are preferably tapered to facilitate the insertion of the fibers (52) into the spaces.
Abstract:
An automatic gain control technique integrates samples of an incoming analog signal a controlled amount of time so that the magnitudes of the samples lie within the desired input window of an analog-to-digital converter or other signal processing device. The values of the samples are then determined from a combination of the output of the signal processing device and their integration time. This is utilized in a system for determining the temperature of a surface of an object, without contacting the surface, by measuring the level of its infra-red radiation emission. A particular application of the system is to measure the temperature of a semiconductor wafer within a processing chamber while forming integrated circuits on it. The measuring system is configured on a single printed circuit board with an extra height metal heat sink structure to which a cooling unit is mounted. A photodetector and a circuit chip which performs the signal integrations are mounted within the cooling unit and operated at a uniform temperature. The combination of the variable time integration and cooling techniques greatly increases the signal-to-noise ratio of the measuring system. This allows surface temperature measurements to be made down to about 250 DEG C by measuring object emissions at slightly less than one micron in wavelength, conditions which provide signal levels which are normally too weak to measure accurately.
Abstract:
Several types of optical sensors capable of measuring temperature, pressure, force, acceleration, radiation and electrical fields, fluid level, vapor pressure, etc., along with an electro-optical system for detecting the optical signal developed by the sensor. One probe utilizes a convex shaped structure (85) consisting of an elastomeric material (97) attached to an end of an optical fiber (87), the elastomeric material (97) being coated with a luminescent material (95), a combination capable of measuring both temperature and pressure. This probe is also specifically adapted for measuring surface temperature by making a good physical contact with the surface (99) being measured. Another such probe utilizes a non-elastomeric material (137) for the purpose of detecting both temperature and either index of refraction or vapor pressure changes. Improvements in other existing sensors (201) of physical parameters besides temperature are described wherein temperature is simultaneously measured for correcting such physical parameter measurements that are affected by temperature variations.
Abstract:
A probe for use within a high voltage and high current electrical device is disclosed. The probe comprises an optical fiber, a substrate having a slot, and a photoluminescent material. The fiber has a first and second end and is configured to convey an activation light from the first to second end. A portion of the fiber is within the slot such that the slot receives the second end of the fiber. Emission of the photoluminescent material, as a function of temperature, is known. The photoluminescent material is disposed within at least a portion of the slot that faces the second end of the fiber so that they are in optical communication with each other. A change in intensity of a luminescent light emitted back into the fiber by the photoluminescent material when the activation light is conveyed by the fiber onto the photoluminescent material provides an indication of the integrity of the electrical device.