公开(公告)号：WO2015195045A1

公开(公告)日：2015-12-23

申请号：PCT/SG2015/050109

申请日：2015-05-13

Applicant: MANUFACTURING INTEGRATION TECHNOLOGY LTD

Inventor： KWONG, Kim Mone ,  LIM, Kok Yeow ,  MAO, Zhiqiang

IPC: H01L21/00 ,  H01L23/00 ,  H01L27/00

CPC classification number: H01L21/6836 ,  H01L21/67132 ,  H01L21/6838 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68354 ,  H01L2221/68386 ,  Y10S156/932 ,  Y10S156/943 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983

Abstract: A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural sets of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip. A vacuum source is utilized for generating vacuum to suck the tape. Plural sets of contacts such as inner, middle and outer contacts are independently or together moved below the tape at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each contact to effectively remove or loosen the tape from the chip. A pick and place unit can then pick up the chip easily without any damage to chip.

Abstract translation: 公开了一种使用多级喷射器从带剥离半导体芯片的系统和方法。 多级喷射器中的壳体容纳多组胶带去除触点。 拾取和放置单元缓慢移动以与芯片接触。 利用真空源产生真空吸吸胶带。 通过利用它们各自的致动机构，诸如内部，中部和外部触点的多组触点独立地或一起在各种阶段在带下方移动。 控制器可以独立地控制每个触点的移动，以有效地从芯片上移除或松开磁带。 拾取和放置单元可以轻松拾取芯片，而不会对芯片造成任何损坏。