公开(公告)号：WO2015030699A3

公开(公告)日：2015-08-20

申请号：PCT/US2013048462

申请日：2013-06-28

Applicant: MATERION CORP

Inventor： WITYAK GEORGE MICHAEL ,  KOBA RICHARD

IPC: H01L23/06 ,  H01L23/12 ,  H01L23/14

CPC classification number: H01L23/3736 ,  H01L23/10 ,  H01L23/142 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A high thermal conductivity base plate is provided for use in air cavity packages. The base plate is at least partially comprised of reinforced silver composite. The composite can include a matrix of pure silver or a silver alloy and reinforcement particles. The reinforcement particles can include high thermal conductivity, low CTE particles selected from the group consisting of diamond, cubic boron nitride (c-BN), silicon carbide (SiC), and any combinations thereof. In some embodiments, the base plate is entirely comprised of the composite. In other embodiments, the base plate has a core made of the composite. The core can include at least one outer layer on the core. The semiconductor package can include one or more dice or transistors on the base plate, an insulated frame on the base plate, and one or more leads on the insulated frame.

Abstract translation: 提供了一种用于气腔封装的高导热性底板。 基板至少部分地由增强的银复合材料构成。 复合材料可以包括纯银或银合金的基体和增强颗粒。 增强颗粒可以包括高导热性，选自金刚石，立方氮化硼（c-BN），碳化硅（SiC）及其任何组合的低CTE颗粒。 在一些实施例中，基板完全由复合材料构成。 在其他实施例中，基板具有由复合材料制成的芯。 芯可以包括芯上的至少一个外层。 半导体封装可以包括基板上的一个或多个骰子或晶体管，基板上的绝缘框架，以及绝缘框架上的一个或多个引线。