公开(公告)号：WO2018175269A1

公开(公告)日：2018-09-27

申请号：PCT/US2018/023048

申请日：2018-03-19

Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

Inventor： GLOSTER, Mark Mitchell ,  GIAIMO, Whitney ,  GODFREY, John

IPC: H05K9/00

CPC classification number: H05K9/0032 ,  H05K1/181 ,  H05K3/303 ,  H05K9/0026 ,  H05K2201/10227

Abstract: The edge shields disclosed herein utilize a plated edge surface of a PCB to form one or more sides of an electronic shield to reduce the amount of top surface area of the PCB occupied by the electronic shield. More specifically, an edge shield lid is mechanically attached to the plated edge surface to remove a need for solder overprint at the edge of the PCB. The edge shield lid is soldered, welded, adhered, or mechanically attached to edge walls where there is no available edge surface for attachment.

公开(公告)号：WO2016153745A1

公开(公告)日：2016-09-29

申请号：PCT/US2016/020309

申请日：2016-03-02

Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

Inventor： BONICATTO, James Michael ,  HILL, Andrew William ,  THOME, Nathan Michael ,  GODFREY, John ,  MCLAUGHLIN, Robyn ,  SHETTY, Santosh

IPC: H05K3/40 ,  H05K7/14 ,  H01R12/52 ,  H05K1/14 ,  H05K3/36

CPC classification number: F16B5/00 ,  H01R12/7047 ,  H05K3/30 ,  H05K7/1407 ,  H05K7/1417 ,  H05K2201/10303 ,  H05K2201/1031 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/2036 ,  Y02P70/611

Abstract: Examples of the disclosure enable a printed circuit board (102) to be coupled to a chassis. In some examples, a coupling mechanism (104) includes a first body (118) including a head portion (120) and a shaft portion (122) that has an inner surface defining a channel (138). The coupling mechanism (104) includes a second body (156) including a head portion (158) and a shaft portion (160). At least a part of the second body shaft portion is positionable within the channel. An outer surface (174) of the second body shaft portion is sized to enable the second body shaft portion to expand radially or move laterally within the channel when the part of the second shaft portion is positioned within the channel. Examples of the disclosure enable the printed circuit board to be coupled to a chassis in low-profile, reduced-stress manner.

Abstract translation: 本公开的示例使得印刷电路板（102）能够耦合到底架。 在一些示例中，联接机构（104）包括包括头部（120）和具有限定通道（138）的内表面的轴部分（122）的第一主体（118）。 联接机构（104）包括包括头部（158）和轴部（160）的第二主体（156）。 第二主体轴部分的至少一部分可定位在通道内。 第二主体轴部分的外表面（174）的尺寸设定成使得当第二轴部分的部分位于通道内时，第二主体轴部分能够在通道内径向扩张或横向移动。 本公开的实例使得印刷电路板能够以低调，低应力的方式耦合到底盘。